Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors

Narrow-bandgap germanium–tin (GeSn) is employed to fabricate metal–semiconductor–metal (MSM) near-infrared photodetectors with low-dark currents and high responsivity. To reduce the dark current, the SiO<sub>2</sub> layer is inserted in between the metal and semiconductor to increase the...

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Main Authors: Ricky Wenkuei Chuang, Yu-Hsin Huang, Tsung-Han Tsai
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/10/1733
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author Ricky Wenkuei Chuang
Yu-Hsin Huang
Tsung-Han Tsai
author_facet Ricky Wenkuei Chuang
Yu-Hsin Huang
Tsung-Han Tsai
author_sort Ricky Wenkuei Chuang
collection DOAJ
description Narrow-bandgap germanium–tin (GeSn) is employed to fabricate metal–semiconductor–metal (MSM) near-infrared photodetectors with low-dark currents and high responsivity. To reduce the dark current, the SiO<sub>2</sub> layer is inserted in between the metal and semiconductor to increase the barrier height, albeit at the expense of photocurrent reduction. To couple more incident light into the absorption layer to enhance the responsivity, the distributed Bragg reflectors (DBRs) are deposited at the bottom of the GeSn substrate while placing the anti-reflection layer on the surface of the absorption layer. With the interdigital electrode spacing and width, both set at 5 µm and with 1 V bias applied, it is found the responsivities of the generic MSM control sample detector, the MSM with DBR, and the MSM with AR layer are 0.644 A/W, 0.716 A/W, and 1.30 A/W, respectively. The corresponding specific detectivities are 8.77 × 10<sup>10</sup>, 1.11 × 10<sup>11</sup>, and 1.77 × 10<sup>11</sup> cm·Hz<sup>1/2</sup>/W, respectively. The measurement data show that these designs effectively enhance the photocurrent and responsivity. At 1 V bias voltage, normalized responsivity evinces that the photodetection range has been extended from 1550 nm to over 2000 nm, covering the entire telecommunication band. Incorporating GeSn as a sensing layer offers one of the new alternative avenues for IR photodetection.
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spelling doaj.art-c2651b8aba35443bab55bfb12a46103f2023-11-24T01:23:34ZengMDPI AGMicromachines2072-666X2022-10-011310173310.3390/mi13101733Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared PhotodetectorsRicky Wenkuei Chuang0Yu-Hsin Huang1Tsung-Han Tsai2Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, TaiwanInstitute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, TaiwanInstitute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, TaiwanNarrow-bandgap germanium–tin (GeSn) is employed to fabricate metal–semiconductor–metal (MSM) near-infrared photodetectors with low-dark currents and high responsivity. To reduce the dark current, the SiO<sub>2</sub> layer is inserted in between the metal and semiconductor to increase the barrier height, albeit at the expense of photocurrent reduction. To couple more incident light into the absorption layer to enhance the responsivity, the distributed Bragg reflectors (DBRs) are deposited at the bottom of the GeSn substrate while placing the anti-reflection layer on the surface of the absorption layer. With the interdigital electrode spacing and width, both set at 5 µm and with 1 V bias applied, it is found the responsivities of the generic MSM control sample detector, the MSM with DBR, and the MSM with AR layer are 0.644 A/W, 0.716 A/W, and 1.30 A/W, respectively. The corresponding specific detectivities are 8.77 × 10<sup>10</sup>, 1.11 × 10<sup>11</sup>, and 1.77 × 10<sup>11</sup> cm·Hz<sup>1/2</sup>/W, respectively. The measurement data show that these designs effectively enhance the photocurrent and responsivity. At 1 V bias voltage, normalized responsivity evinces that the photodetection range has been extended from 1550 nm to over 2000 nm, covering the entire telecommunication band. Incorporating GeSn as a sensing layer offers one of the new alternative avenues for IR photodetection.https://www.mdpi.com/2072-666X/13/10/1733metal–semiconductor–metal (MSM) photodetectorsgermanium–tin (GeSn)near-infrareddistributed Bragg reflector (DBR)anti-reflection layer
spellingShingle Ricky Wenkuei Chuang
Yu-Hsin Huang
Tsung-Han Tsai
Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors
Micromachines
metal–semiconductor–metal (MSM) photodetectors
germanium–tin (GeSn)
near-infrared
distributed Bragg reflector (DBR)
anti-reflection layer
title Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors
title_full Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors
title_fullStr Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors
title_full_unstemmed Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors
title_short Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors
title_sort germanium tin gesn metal semiconductor metal msm near infrared photodetectors
topic metal–semiconductor–metal (MSM) photodetectors
germanium–tin (GeSn)
near-infrared
distributed Bragg reflector (DBR)
anti-reflection layer
url https://www.mdpi.com/2072-666X/13/10/1733
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AT yuhsinhuang germaniumtingesnmetalsemiconductormetalmsmnearinfraredphotodetectors
AT tsunghantsai germaniumtingesnmetalsemiconductormetalmsmnearinfraredphotodetectors