Displacement Analysis of the MEMS Device

In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the curre...

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Main Author: Ishak Ertugrul
Format: Article
Language:English
Published: The Netherlands Press 2020-09-01
Series:Metallurgical & Materials Engineering
Subjects:
Online Access:https://metall-mater-eng.com/index.php/home/article/view/504
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author Ishak Ertugrul
author_facet Ishak Ertugrul
author_sort Ishak Ertugrul
collection DOAJ
description In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.
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spelling doaj.art-c388787f351e43d4a985a4f5aedcb3aa2023-01-03T10:52:50ZengThe Netherlands PressMetallurgical & Materials Engineering2217-89612020-09-0127217117610.30544/504504Displacement Analysis of the MEMS DeviceIshak Ertugrul0Mus Alparslan University, Faculty of Technical Science, Department of Mechatronics, Mus, 49100, TurkeyIn this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.https://metall-mater-eng.com/index.php/home/article/view/504mems; displacement; metallic materials; current.
spellingShingle Ishak Ertugrul
Displacement Analysis of the MEMS Device
Metallurgical & Materials Engineering
mems; displacement; metallic materials; current.
title Displacement Analysis of the MEMS Device
title_full Displacement Analysis of the MEMS Device
title_fullStr Displacement Analysis of the MEMS Device
title_full_unstemmed Displacement Analysis of the MEMS Device
title_short Displacement Analysis of the MEMS Device
title_sort displacement analysis of the mems device
topic mems; displacement; metallic materials; current.
url https://metall-mater-eng.com/index.php/home/article/view/504
work_keys_str_mv AT ishakertugrul displacementanalysisofthememsdevice