Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System
In order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at nighttime. First, a simple testing rig was made with...
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| Format: | Article |
| Language: | English |
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MDPI AG
2019-12-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/13/1/106 |
| _version_ | 1797999085581500416 |
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| author | Cairui Yu Dongmei Shen Qingyang Jiang Wei He Hancheng Yu Zhongting Hu Hongbing Chen Pengkun Yu Sheng Zhang |
| author_facet | Cairui Yu Dongmei Shen Qingyang Jiang Wei He Hancheng Yu Zhongting Hu Hongbing Chen Pengkun Yu Sheng Zhang |
| author_sort | Cairui Yu |
| collection | DOAJ |
| description | In order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at nighttime. First, a simple testing rig was made with an MHP and a radiative plate, where the radiative plate was made of acrylic resin, a curing agent, thinner, and aluminum plate, and had strong radiative cooling at nighttime. Second, the mathematical model was initially established and verified using experiments, where it was shown that the agreement between numerical and experimental data was well within experimental uncertainties. Comprehensive simulation investigations were conducted by varying wind speed, relative humidity, the cloudiness coefficient, dimension of the radiative plate, and tilted angle. The results show that: (1) the emissivity of the radiative plate was about 0.311 in the daytime and about 0.908 in the nighttime; (2) the influence of wind speed on reducing the component surface temperature was greater than the cloudiness coefficient and relative humidity; (3) the width of the radiative plate had a greater effect on heat dissipation than on its length, and the maximum size of radiative plate was recommended to be 400 mm × 400−500 mm (length × width), which was equipped with a single MHP (width: 60 mm). Additionally, the tilted angle of the radiative plate should be kept within 30° of the horizontal level. In conclusion, the novel heat dissipation system had a superior application value for providing assisted electronic component cooling in the nighttime. |
| first_indexed | 2024-04-11T10:59:00Z |
| format | Article |
| id | doaj.art-c4c51774429944e7a7398158358d2003 |
| institution | Directory Open Access Journal |
| issn | 1996-1073 |
| language | English |
| last_indexed | 2024-04-11T10:59:00Z |
| publishDate | 2019-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj.art-c4c51774429944e7a7398158358d20032022-12-22T04:28:41ZengMDPI AGEnergies1996-10732019-12-0113110610.3390/en13010106en13010106Numerical and Experimental Study on the Heat Dissipation Performance of a Novel SystemCairui Yu0Dongmei Shen1Qingyang Jiang2Wei He3Hancheng Yu4Zhongting Hu5Hongbing Chen6Pengkun Yu7Sheng Zhang8Department of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, ChinaDepartment of Architecture and Civil Engineering, West Anhui University, Lu’an 237012, ChinaCollege of Civil Engineering and Architecture, Jiaxing University, Jiaxing 314001, ChinaDepartment of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, ChinaQinghai College of Architectural Technology, Xining 810002, ChinaDepartment of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, ChinaSchool of Environment and Energy Engineering, Beijing University of Civil Engineering and Architecture, Beijing 100044, ChinaDepartment of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, ChinaDepartment of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, ChinaIn order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at nighttime. First, a simple testing rig was made with an MHP and a radiative plate, where the radiative plate was made of acrylic resin, a curing agent, thinner, and aluminum plate, and had strong radiative cooling at nighttime. Second, the mathematical model was initially established and verified using experiments, where it was shown that the agreement between numerical and experimental data was well within experimental uncertainties. Comprehensive simulation investigations were conducted by varying wind speed, relative humidity, the cloudiness coefficient, dimension of the radiative plate, and tilted angle. The results show that: (1) the emissivity of the radiative plate was about 0.311 in the daytime and about 0.908 in the nighttime; (2) the influence of wind speed on reducing the component surface temperature was greater than the cloudiness coefficient and relative humidity; (3) the width of the radiative plate had a greater effect on heat dissipation than on its length, and the maximum size of radiative plate was recommended to be 400 mm × 400−500 mm (length × width), which was equipped with a single MHP (width: 60 mm). Additionally, the tilted angle of the radiative plate should be kept within 30° of the horizontal level. In conclusion, the novel heat dissipation system had a superior application value for providing assisted electronic component cooling in the nighttime.https://www.mdpi.com/1996-1073/13/1/106electronic coolingmicrochannel piperadiative coolingnumerical study |
| spellingShingle | Cairui Yu Dongmei Shen Qingyang Jiang Wei He Hancheng Yu Zhongting Hu Hongbing Chen Pengkun Yu Sheng Zhang Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System Energies electronic cooling microchannel pipe radiative cooling numerical study |
| title | Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System |
| title_full | Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System |
| title_fullStr | Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System |
| title_full_unstemmed | Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System |
| title_short | Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System |
| title_sort | numerical and experimental study on the heat dissipation performance of a novel system |
| topic | electronic cooling microchannel pipe radiative cooling numerical study |
| url | https://www.mdpi.com/1996-1073/13/1/106 |
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