High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation

High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation

In this study, thermal and argon (Ar) plasma/wetting treatments were combined to enhance the bonding strength of polyimide (PI) films. Attenuated total reflectance-Fourier transform infrared spectroscopy (ATR-FTIR) was used to analyze the changes in the PI imidization degrees. The contact angles of...

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Bibliographic Details
Main Authors:	Pin-Syuan He, Dinh-Phuc Tran, Ting-Yu Kuo, Wei-You Hsu, Huai-En Lin, Kai-Cheng Shie, Chih Chen
Format:	Article
Language:	English
Published:	MDPI AG 2023-05-01
Series:	Nanomaterials
Subjects:	polyimide bonding strength partial curing hybrid bonding surface modification
Online Access:	https://www.mdpi.com/2079-4991/13/9/1575

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