Improvement of thermal and optical behavior of multi-chip LEDs package

Improvement of thermal and optical behavior of multi-chip LEDs package

Thermal management of light emitting diodes (LEDs) packages is indispensable to maintain lower operating temperature. The present paper reports a numerical analysis of 45W LEDs module. Two forms of substrate and chips are compared. Results show that circular chips mounted on circular substrate provi...

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Bibliographic Details
Main Authors: Khaoula Ben Abdelmlek, Zouhour Araoud, Kamel Charrada, Georges Zissis, Laurent Canale
Format: Article
Language:English
Published: Elsevier 2022-11-01
Series:Case Studies in Thermal Engineering
Subjects:
Multi-chip LED package
thermal management
Chips spacing
circular design
rectangular design
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X22006311

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http://www.sciencedirect.com/science/article/pii/S2214157X22006311

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