CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY
Sn-Cu alloys are promising alternatives to the replacement of Pb-containing solder alloys. However, the effects of the cooling rate on the solidification microstructures of these alloys and the corresponding influence on the mechanical and corrosion resistances are not well known. In the present s...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Associação Brasileira de Metalurgia, Materiais e Mineração
2014-12-01
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| Series: | Tecnologia em Metalurgia, Materiais e Mineração |
| Subjects: | |
| Online Access: | http://www.tecnologiammm.com.br/files/v11n4/v11n4a01.pdf |
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| author | José Eduardo Spinelli Noé Cheung Wislei Riuper Ramos Osório Emmanuelle Sá Freitas Amauri Garcia |
| author_facet | José Eduardo Spinelli Noé Cheung Wislei Riuper Ramos Osório Emmanuelle Sá Freitas Amauri Garcia |
| author_sort | José Eduardo Spinelli |
| collection | DOAJ |
| description | Sn-Cu alloys are promising alternatives to the replacement of Pb-containing solder alloys. However, the effects of
the cooling rate on the solidification microstructures of these alloys and the corresponding influence on the mechanical
and corrosion resistances are not well known. In the present study, the transient directional solidification technique has
been used to obtain a Sn-0,7wt.%Cu ingot. The experimental results include: solidification thermal parameters (cooling
rate, Ṫ, growth rate, v, and metal/substrate heat transfer coefficient, hi
), cellular spacing, λc
, and primary dendritic arm
spacing, λ1
, corrosion rate, corrosion potential and polarization resistance and mechanical strength and ductility. The
results show a cellular/dendritic transition with eutectic cells prevailing for Ṫ< 0,9°C/s. Lower corrosion resistances have
been associated with dendritic regions compared with regions characterized by eutectic cells. In the interdendritic regions
extremely fine and fibrous Cu6
Sn5
intermetallic particles can be observed. |
| first_indexed | 2024-03-12T07:46:11Z |
| format | Article |
| id | doaj.art-c6374de3f8d74ff29c3bdb402229df80 |
| institution | Directory Open Access Journal |
| issn | 2176-1515 2176-1523 |
| language | English |
| last_indexed | 2024-03-12T07:46:11Z |
| publishDate | 2014-12-01 |
| publisher | Associação Brasileira de Metalurgia, Materiais e Mineração |
| record_format | Article |
| series | Tecnologia em Metalurgia, Materiais e Mineração |
| spelling | doaj.art-c6374de3f8d74ff29c3bdb402229df802023-09-02T21:02:14ZengAssociação Brasileira de Metalurgia, Materiais e MineraçãoTecnologia em Metalurgia, Materiais e Mineração2176-15152176-15232014-12-01114286http://dx.doi.org/10.4322/tmm.2014.045CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOYJosé Eduardo Spinelli0Noé Cheung1Wislei Riuper Ramos Osório2Emmanuelle Sá Freitas3Amauri Garcia4Doutor, Departamento de Engenharia de Materiais, Universidade Federal de São Carlos – UFSCar, São Carlos, SP, BrasilDoutor(a), Departamento de Engenharia de Materiais, Faculdade de Engenharia Mecânica, Universidade Estadual de Campinas – UNICAMP, Campinas, SP, Brasil. EDoutor, Faculdade de Ciências Aplicadas, Universidade Estadual de Campinas – UNICAMP, Limeira, SP, BrasilDoutor(a), Departamento de Engenharia de Materiais, Faculdade de Engenharia Mecânica, Universidade Estadual de Campinas – UNICAMP, Campinas, SP, Brasil. EDoutor(a), Departamento de Engenharia de Materiais, Faculdade de Engenharia Mecânica, Universidade Estadual de Campinas – UNICAMP, Campinas, SP, Brasil. ESn-Cu alloys are promising alternatives to the replacement of Pb-containing solder alloys. However, the effects of the cooling rate on the solidification microstructures of these alloys and the corresponding influence on the mechanical and corrosion resistances are not well known. In the present study, the transient directional solidification technique has been used to obtain a Sn-0,7wt.%Cu ingot. The experimental results include: solidification thermal parameters (cooling rate, Ṫ, growth rate, v, and metal/substrate heat transfer coefficient, hi ), cellular spacing, λc , and primary dendritic arm spacing, λ1 , corrosion rate, corrosion potential and polarization resistance and mechanical strength and ductility. The results show a cellular/dendritic transition with eutectic cells prevailing for Ṫ< 0,9°C/s. Lower corrosion resistances have been associated with dendritic regions compared with regions characterized by eutectic cells. In the interdendritic regions extremely fine and fibrous Cu6 Sn5 intermetallic particles can be observed.http://www.tecnologiammm.com.br/files/v11n4/v11n4a01.pdfSn-Cu alloy; Solidification; Mechanical properties; Corrosion. |
| spellingShingle | José Eduardo Spinelli Noé Cheung Wislei Riuper Ramos Osório Emmanuelle Sá Freitas Amauri Garcia CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY Tecnologia em Metalurgia, Materiais e Mineração Sn-Cu alloy; Solidification; Mechanical properties; Corrosion. |
| title | CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY |
| title_full | CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY |
| title_fullStr | CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY |
| title_full_unstemmed | CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY |
| title_short | CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY |
| title_sort | correlation between microstructure and mechanical and corrosion resistances of a lead free sn 0 7 cu solder alloy |
| topic | Sn-Cu alloy; Solidification; Mechanical properties; Corrosion. |
| url | http://www.tecnologiammm.com.br/files/v11n4/v11n4a01.pdf |
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