CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY
Sn-Cu alloys are promising alternatives to the replacement of Pb-containing solder alloys. However, the effects of the cooling rate on the solidification microstructures of these alloys and the corresponding influence on the mechanical and corrosion resistances are not well known. In the present s...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Associação Brasileira de Metalurgia, Materiais e Mineração
2014-12-01
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| Series: | Tecnologia em Metalurgia, Materiais e Mineração |
| Subjects: | |
| Online Access: | http://www.tecnologiammm.com.br/files/v11n4/v11n4a01.pdf |