A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling Inks

The direct-ink-writing (DIW) has been widely used to print various functional devices using different self-leveling inks. Due to the complicated rheological behavior and multiple processing parameters, how to rapidly determine the crucial parameter for high-precision printing is still challenging. H...

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Main Authors: Maoyang Li, Yin Tao, Peishi Yu
Format: Article
Language:English
Published: MDPI AG 2023-04-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/13/8/4950
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author Maoyang Li
Yin Tao
Peishi Yu
author_facet Maoyang Li
Yin Tao
Peishi Yu
author_sort Maoyang Li
collection DOAJ
description The direct-ink-writing (DIW) has been widely used to print various functional devices using different self-leveling inks. Due to the complicated rheological behavior and multiple processing parameters, how to rapidly determine the crucial parameter for high-precision printing is still challenging. Here we adapt a widely used commercial silver paste and identify the critical parameter for dominating the flatness through observation of the microstructure evolution for the line-to-layer forming process. An analytical model for flatness with printing parameters was established. Using the proposed model, the printing process parameters for achieving high flatness can be directly determined, avoiding the high cost of extensive experimental exploration.
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spelling doaj.art-c7d8bd98950742fb846246a55a3231472023-11-17T18:11:48ZengMDPI AGApplied Sciences2076-34172023-04-01138495010.3390/app13084950A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling InksMaoyang Li0Yin Tao1Peishi Yu2Jiangnan Key Laboratory of Advanced Food Manufacturing Equipment and Technology, School of Mechanical Engineering, Jiangnan University, Wuxi 214122, ChinaJiangnan Key Laboratory of Advanced Food Manufacturing Equipment and Technology, School of Mechanical Engineering, Jiangnan University, Wuxi 214122, ChinaJiangnan Key Laboratory of Advanced Food Manufacturing Equipment and Technology, School of Mechanical Engineering, Jiangnan University, Wuxi 214122, ChinaThe direct-ink-writing (DIW) has been widely used to print various functional devices using different self-leveling inks. Due to the complicated rheological behavior and multiple processing parameters, how to rapidly determine the crucial parameter for high-precision printing is still challenging. Here we adapt a widely used commercial silver paste and identify the critical parameter for dominating the flatness through observation of the microstructure evolution for the line-to-layer forming process. An analytical model for flatness with printing parameters was established. Using the proposed model, the printing process parameters for achieving high flatness can be directly determined, avoiding the high cost of extensive experimental exploration.https://www.mdpi.com/2076-3417/13/8/4950direct-ink-writingprocessing modelhigh-flatness layermicrostructure evolution
spellingShingle Maoyang Li
Yin Tao
Peishi Yu
A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling Inks
Applied Sciences
direct-ink-writing
processing model
high-flatness layer
microstructure evolution
title A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling Inks
title_full A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling Inks
title_fullStr A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling Inks
title_full_unstemmed A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling Inks
title_short A Processing Model toward Printing High-Flatness Layers for Direct-Ink-Writing Printed Self-Leveling Inks
title_sort processing model toward printing high flatness layers for direct ink writing printed self leveling inks
topic direct-ink-writing
processing model
high-flatness layer
microstructure evolution
url https://www.mdpi.com/2076-3417/13/8/4950
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