Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules
Flip chip technology has been widely adopted in modern power light-emitting diode (LED) fabrications and its output efficiency is closely related to the submount material properties. Here, we present the electrical, optical and thermal properties of flip chip light-emitting diodes mounted on transpa...
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| Format: | Article |
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MDPI AG
2016-06-01
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| Series: | Applied Sciences |
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| Online Access: | http://www.mdpi.com/2076-3417/6/6/179 |
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| author | Preetpal Singh Der-Hwa Yeh Cher-Ming Tan Chao-Sung Lai Chih-Teng Hou Ting-Yu Chao Liann-Be Chang |
| author_facet | Preetpal Singh Der-Hwa Yeh Cher-Ming Tan Chao-Sung Lai Chih-Teng Hou Ting-Yu Chao Liann-Be Chang |
| author_sort | Preetpal Singh |
| collection | DOAJ |
| description | Flip chip technology has been widely adopted in modern power light-emitting diode (LED) fabrications and its output efficiency is closely related to the submount material properties. Here, we present the electrical, optical and thermal properties of flip chip light-emitting diodes mounted on transparent sapphire and borosilicate glass which have shown a higher output luminous flux when compared to the traditional non-transparent mounted LEDs. Exhibiting both better thermal conductivity and good optical transparency, flip chip LEDs with a sapphire submount showed superior performance when compared to the non-transparent silicon submount ones, and also showed better optical performance than the flip chip LEDs mounted on transparent but poor-thermal-conducting glass substrates. The correspondent analysis was carried out using ANSYS 14 to compare the experimental thermal imaging with the simulation results. TracePro software was also used to check the output luminous flux dependency on different LED mounting designs. |
| first_indexed | 2024-12-11T18:27:06Z |
| format | Article |
| id | doaj.art-c865d87fc7b3402082088ceb432db6ee |
| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-12-11T18:27:06Z |
| publishDate | 2016-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj.art-c865d87fc7b3402082088ceb432db6ee2022-12-22T00:55:02ZengMDPI AGApplied Sciences2076-34172016-06-016617910.3390/app6060179app6060179Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode ModulesPreetpal Singh0Der-Hwa Yeh1Cher-Ming Tan2Chao-Sung Lai3Chih-Teng Hou4Ting-Yu Chao5Liann-Be Chang6Department of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, TaiwanDepartment of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, TaiwanDepartment of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, TaiwanDepartment of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, TaiwanDepartment of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, TaiwanDepartment of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, TaiwanDepartment of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, TaiwanFlip chip technology has been widely adopted in modern power light-emitting diode (LED) fabrications and its output efficiency is closely related to the submount material properties. Here, we present the electrical, optical and thermal properties of flip chip light-emitting diodes mounted on transparent sapphire and borosilicate glass which have shown a higher output luminous flux when compared to the traditional non-transparent mounted LEDs. Exhibiting both better thermal conductivity and good optical transparency, flip chip LEDs with a sapphire submount showed superior performance when compared to the non-transparent silicon submount ones, and also showed better optical performance than the flip chip LEDs mounted on transparent but poor-thermal-conducting glass substrates. The correspondent analysis was carried out using ANSYS 14 to compare the experimental thermal imaging with the simulation results. TracePro software was also used to check the output luminous flux dependency on different LED mounting designs.http://www.mdpi.com/2076-3417/6/6/179flip chiplight emitting diodetransparent submountlight extraction |
| spellingShingle | Preetpal Singh Der-Hwa Yeh Cher-Ming Tan Chao-Sung Lai Chih-Teng Hou Ting-Yu Chao Liann-Be Chang Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules Applied Sciences flip chip light emitting diode transparent submount light extraction |
| title | Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules |
| title_full | Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules |
| title_fullStr | Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules |
| title_full_unstemmed | Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules |
| title_short | Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules |
| title_sort | output properties of transparent submount packaged flipchip light emitting diode modules |
| topic | flip chip light emitting diode transparent submount light extraction |
| url | http://www.mdpi.com/2076-3417/6/6/179 |
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