Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules

Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules

Flip chip technology has been widely adopted in modern power light-emitting diode (LED) fabrications and its output efficiency is closely related to the submount material properties. Here, we present the electrical, optical and thermal properties of flip chip light-emitting diodes mounted on transpa...

Full description

Bibliographic Details
Main Authors: Preetpal Singh, Der-Hwa Yeh, Cher-Ming Tan, Chao-Sung Lai, Chih-Teng Hou, Ting-Yu Chao, Liann-Be Chang
Format: Article
Language:English
Published: MDPI AG 2016-06-01
Series:Applied Sciences
Subjects:
flip chip
light emitting diode
transparent submount
light extraction
Online Access:http://www.mdpi.com/2076-3417/6/6/179

Internet

http://www.mdpi.com/2076-3417/6/6/179

Similar Items