Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS Process
Spark plasma sintering technique is used for the fabrication of dense materials with a fine-grained microstructure. In this process, a powder is placed into a graphite mold and a uniaxial pressure is applied by two graphite punches. A graphite foil is inserted between the punches and the powder and...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-12-01
|
| Series: | Solids |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-6497/2/4/25 |
| _version_ | 1797500532855668736 |
|---|---|
| author | Maria-Rosa Ardigo-Besnard Aurélien Besnard Mathias Moser Florian Bussière |
| author_facet | Maria-Rosa Ardigo-Besnard Aurélien Besnard Mathias Moser Florian Bussière |
| author_sort | Maria-Rosa Ardigo-Besnard |
| collection | DOAJ |
| description | Spark plasma sintering technique is used for the fabrication of dense materials with a fine-grained microstructure. In this process, a powder is placed into a graphite mold and a uniaxial pressure is applied by two graphite punches. A graphite foil is inserted between the punches and the powder and between the mold and the powder to ensure good electrical, physical and thermal contact. One of the major drawbacks during sintering of metal powders is the carburization of the powder in contact with the graphite foils. In this study, a PVD coating of titanium was applied on the graphite foils in contact with the metal powder (pure iron). The results are promising, as the investigations show that the application of a Ti PVD film of 1.5 and 1.1 µm thickness is effective to completely avoid the carburization of iron powder. Carbon diffuses inside the PVD film during sintering. In parallel, iron diffusion was revealed inside the Ti coating of 1.5 µm thickness. On the other hand, a Ti PVD film of 0.5 µm thickness provides a protection against carbon diffusion just on the sides in contact with the mold, proving that the coating thickness represents an important parameter to consider. |
| first_indexed | 2024-03-10T03:05:09Z |
| format | Article |
| id | doaj.art-c875e4951cc8456398a9e68fa5bcec5e |
| institution | Directory Open Access Journal |
| issn | 2673-6497 |
| language | English |
| last_indexed | 2024-03-10T03:05:09Z |
| publishDate | 2021-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Solids |
| spelling | doaj.art-c875e4951cc8456398a9e68fa5bcec5e2023-11-23T10:34:40ZengMDPI AGSolids2673-64972021-12-012439540610.3390/solids2040025Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS ProcessMaria-Rosa Ardigo-Besnard0Aurélien Besnard1Mathias Moser2Florian Bussière3Laboratoire Interdisciplinaire Carnot de Bourgogne (ICB), UMR 6303 CNRS, Université Bourgogne Franche-Comté, BP 47870, CEDEX, 21078 Dijon, FranceArts et Metiers Institute of Technology, LaBoMaP, Université Bourgogne Franche-Comté, HESAM Université, 71250 Cluny, FranceLaboratoire Interdisciplinaire Carnot de Bourgogne (ICB), UMR 6303 CNRS, Université Bourgogne Franche-Comté, BP 47870, CEDEX, 21078 Dijon, FranceLaboratoire Interdisciplinaire Carnot de Bourgogne (ICB), UMR 6303 CNRS, Université Bourgogne Franche-Comté, BP 47870, CEDEX, 21078 Dijon, FranceSpark plasma sintering technique is used for the fabrication of dense materials with a fine-grained microstructure. In this process, a powder is placed into a graphite mold and a uniaxial pressure is applied by two graphite punches. A graphite foil is inserted between the punches and the powder and between the mold and the powder to ensure good electrical, physical and thermal contact. One of the major drawbacks during sintering of metal powders is the carburization of the powder in contact with the graphite foils. In this study, a PVD coating of titanium was applied on the graphite foils in contact with the metal powder (pure iron). The results are promising, as the investigations show that the application of a Ti PVD film of 1.5 and 1.1 µm thickness is effective to completely avoid the carburization of iron powder. Carbon diffuses inside the PVD film during sintering. In parallel, iron diffusion was revealed inside the Ti coating of 1.5 µm thickness. On the other hand, a Ti PVD film of 0.5 µm thickness provides a protection against carbon diffusion just on the sides in contact with the mold, proving that the coating thickness represents an important parameter to consider.https://www.mdpi.com/2673-6497/2/4/25physical vapor depositionthin filmspark plasma sinteringpowder metallurgycarbon diffusion |
| spellingShingle | Maria-Rosa Ardigo-Besnard Aurélien Besnard Mathias Moser Florian Bussière Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS Process Solids physical vapor deposition thin film spark plasma sintering powder metallurgy carbon diffusion |
| title | Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS Process |
| title_full | Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS Process |
| title_fullStr | Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS Process |
| title_full_unstemmed | Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS Process |
| title_short | Development of Ti PVD Films to Limit the Carburization of Metal Powders during SPS Process |
| title_sort | development of ti pvd films to limit the carburization of metal powders during sps process |
| topic | physical vapor deposition thin film spark plasma sintering powder metallurgy carbon diffusion |
| url | https://www.mdpi.com/2673-6497/2/4/25 |
| work_keys_str_mv | AT mariarosaardigobesnard developmentoftipvdfilmstolimitthecarburizationofmetalpowdersduringspsprocess AT aurelienbesnard developmentoftipvdfilmstolimitthecarburizationofmetalpowdersduringspsprocess AT mathiasmoser developmentoftipvdfilmstolimitthecarburizationofmetalpowdersduringspsprocess AT florianbussiere developmentoftipvdfilmstolimitthecarburizationofmetalpowdersduringspsprocess |