Effect of Intermetallic Compound Layer on Peel Strength and Crack Propagation Behavior in Cu/Al/Cu Clad Composites
The effects of interfacial modification in tri-layered Cu/Al/Cu composites by heat treatment on interface stability and crack propagation were investigated. In order to investigate the crack path during the peel test, the intermetallic compound layer with the propagating crack was examined using ele...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-10-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/9/11/1155 |