The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface
W/Cu joining is key for the fabrication of plasma-facing compounds of fusion reactors. In this work, W and Cu are joined through three steps: (1) hydrothermal treatment and reduction annealing (i.e., nano-treatment), (2) Cu plating and annealing in a pure H<sub>2</sub> atmosphere, and (3...
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| Format: | Article |
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MDPI AG
2021-05-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/11/5/844 |
| _version_ | 1797533370477969408 |
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| author | Fei Li Yuanyuan Chen Xin Chen Cai Li Yuan Huang |
| author_facet | Fei Li Yuanyuan Chen Xin Chen Cai Li Yuan Huang |
| author_sort | Fei Li |
| collection | DOAJ |
| description | W/Cu joining is key for the fabrication of plasma-facing compounds of fusion reactors. In this work, W and Cu are joined through three steps: (1) hydrothermal treatment and reduction annealing (i.e., nano-treatment), (2) Cu plating and annealing in a pure H<sub>2</sub> atmosphere, and (3) W/Cu bonding at 980 °C for 3 h. After nano-treatment, nanosheets structure can be found on the W substrate surface. The tensile strength of the W/Cu joint prepared via nano-treatment reaches as high as approximately 93 MPa, which increases by about 60% compared with the one without nano-treatment. The microhardness curves exhibited continuous variations along the W/Cu interface. The TEM images show that the W/Cu interface is compact without any cracks or voids. This work may also be applied for enhancing bonding strength in other immiscible materials. |
| first_indexed | 2024-03-10T11:13:36Z |
| format | Article |
| id | doaj.art-c9833b5cbf7e4fdc9882b0ab169a18a5 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-10T11:13:36Z |
| publishDate | 2021-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-c9833b5cbf7e4fdc9882b0ab169a18a52023-11-21T20:38:19ZengMDPI AGMetals2075-47012021-05-0111584410.3390/met11050844The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W SurfaceFei Li0Yuanyuan Chen1Xin Chen2Cai Li3Yuan Huang4Institute of Advanced Metallic Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, ChinaInstitute of Advanced Metallic Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, ChinaInstitute of Advanced Metallic Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, ChinaInstitute of Advanced Metallic Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, ChinaInstitute of Advanced Metallic Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, ChinaW/Cu joining is key for the fabrication of plasma-facing compounds of fusion reactors. In this work, W and Cu are joined through three steps: (1) hydrothermal treatment and reduction annealing (i.e., nano-treatment), (2) Cu plating and annealing in a pure H<sub>2</sub> atmosphere, and (3) W/Cu bonding at 980 °C for 3 h. After nano-treatment, nanosheets structure can be found on the W substrate surface. The tensile strength of the W/Cu joint prepared via nano-treatment reaches as high as approximately 93 MPa, which increases by about 60% compared with the one without nano-treatment. The microhardness curves exhibited continuous variations along the W/Cu interface. The TEM images show that the W/Cu interface is compact without any cracks or voids. This work may also be applied for enhancing bonding strength in other immiscible materials.https://www.mdpi.com/2075-4701/11/5/844hydrothermal treatmentW/Cu joiningplasma-facing componentsCu plating |
| spellingShingle | Fei Li Yuanyuan Chen Xin Chen Cai Li Yuan Huang The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface Metals hydrothermal treatment W/Cu joining plasma-facing components Cu plating |
| title | The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface |
| title_full | The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface |
| title_fullStr | The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface |
| title_full_unstemmed | The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface |
| title_short | The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface |
| title_sort | improvement of bonding strength of w cu joints via nano treatment of the w surface |
| topic | hydrothermal treatment W/Cu joining plasma-facing components Cu plating |
| url | https://www.mdpi.com/2075-4701/11/5/844 |
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