Low thermal expansion metal composite-based heat spreader for high temperature thermal management

Low thermal expansion metal composite-based heat spreader for high temperature thermal management

The electronic industry is facing pressing needs for cooling system with high-performance in heat transfer and matched coefficient of thermal expansion (CTE) with the chips. Metal composite materials (MCMs) with low CTE can be used in cooling chips to overcome the thermal expansion mismatch between...

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Bibliographic Details
Main Authors: Huanbei Chen, Feiyu Zheng, Weizheng Cheng, Peng Tao, Chengyi Song, Wen Shang, Benwei Fu, Tao Deng
Format: Article
Language:English
Published: Elsevier 2021-10-01
Series:Materials & Design
Subjects:
Thermal management
Metal composite materials
Vapor chamber
High operation temperature
Thermal conductivity
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127521004500

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