Processing and Properties of Single-Crystal Copper Wire
The effects of drawing parameters and annealing process on the properties and microstructure of single crystal copper wire are studied using a wire-drawing machine, heat-treatment equipment, microcomputer-controlled electronic universal tester, resistance tester, and scanning electron microscope. Th...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-11-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/11/2080 |
| _version_ | 1797458401886732288 |
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| author | Jun Cao Xuefeng Wu Chenghao Su Hewei Jia Yongzhen Sun |
| author_facet | Jun Cao Xuefeng Wu Chenghao Su Hewei Jia Yongzhen Sun |
| author_sort | Jun Cao |
| collection | DOAJ |
| description | The effects of drawing parameters and annealing process on the properties and microstructure of single crystal copper wire are studied using a wire-drawing machine, heat-treatment equipment, microcomputer-controlled electronic universal tester, resistance tester, and scanning electron microscope. The results show that, after drawing the single-crystal copper wire with a single-pass deformation of 14%, the grains elongate along the tensile direction, tensile strength increases from 500.83 MPa to 615.5 Mpa, and resistivity changes from 1.745 × 10<sup>−8</sup> Ω·m to 1.732 × 10<sup>−8</sup> Ω·m. After drawing at a drawing rate of 500 m/min, the degree of grain refinement increases and tensile strength increases from 615.5 Mpa to 660.26 Mpa. When a copper wire of Φ0.08 mm is annealed, its tensile strength decreases from 660.26 Mpa to 224.7 Mpa, and elongation increases from 1.494% to 19.87% when the annealing temperature increases to 400 °C. When the annealing temperature increases to 550 °C, the tensile strength and elongation decrease to 214.4 MPa and 12.18%, respectively. |
| first_indexed | 2024-03-09T16:36:35Z |
| format | Article |
| id | doaj.art-ca87a8fd4ab041e2b14870697fdd2dd4 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T16:36:35Z |
| publishDate | 2023-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-ca87a8fd4ab041e2b14870697fdd2dd42023-11-24T14:56:29ZengMDPI AGMicromachines2072-666X2023-11-011411208010.3390/mi14112080Processing and Properties of Single-Crystal Copper WireJun Cao0Xuefeng Wu1Chenghao Su2Hewei Jia3Yongzhen Sun4School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, ChinaSchool of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, ChinaSchool of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, ChinaSchool of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, ChinaSchool of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, ChinaThe effects of drawing parameters and annealing process on the properties and microstructure of single crystal copper wire are studied using a wire-drawing machine, heat-treatment equipment, microcomputer-controlled electronic universal tester, resistance tester, and scanning electron microscope. The results show that, after drawing the single-crystal copper wire with a single-pass deformation of 14%, the grains elongate along the tensile direction, tensile strength increases from 500.83 MPa to 615.5 Mpa, and resistivity changes from 1.745 × 10<sup>−8</sup> Ω·m to 1.732 × 10<sup>−8</sup> Ω·m. After drawing at a drawing rate of 500 m/min, the degree of grain refinement increases and tensile strength increases from 615.5 Mpa to 660.26 Mpa. When a copper wire of Φ0.08 mm is annealed, its tensile strength decreases from 660.26 Mpa to 224.7 Mpa, and elongation increases from 1.494% to 19.87% when the annealing temperature increases to 400 °C. When the annealing temperature increases to 550 °C, the tensile strength and elongation decrease to 214.4 MPa and 12.18%, respectively.https://www.mdpi.com/2072-666X/14/11/2080copper wiremultipass drawingdeformationheat treatment |
| spellingShingle | Jun Cao Xuefeng Wu Chenghao Su Hewei Jia Yongzhen Sun Processing and Properties of Single-Crystal Copper Wire Micromachines copper wire multipass drawing deformation heat treatment |
| title | Processing and Properties of Single-Crystal Copper Wire |
| title_full | Processing and Properties of Single-Crystal Copper Wire |
| title_fullStr | Processing and Properties of Single-Crystal Copper Wire |
| title_full_unstemmed | Processing and Properties of Single-Crystal Copper Wire |
| title_short | Processing and Properties of Single-Crystal Copper Wire |
| title_sort | processing and properties of single crystal copper wire |
| topic | copper wire multipass drawing deformation heat treatment |
| url | https://www.mdpi.com/2072-666X/14/11/2080 |
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