R-Curve Behavior of Polyhedral Oligomeric Silsesquioxane (POSS)–Epoxy Nanocomposites

Polyhedral oligomeric silsesquioxane (POSS) is a suitable nanoscale reinforcement for thermosetting polymers, such as epoxy resin systems in order to modify its mechanical, thermal and chemical properties. The inclusion of POSS in the epoxy resin at higher loading (greater than 1 wt.%); however, it...

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Hlavní autoři: Kunal Mishra, Raman P. Singh
Médium: Článek
Jazyk:English
Vydáno: MDPI AG 2023-01-01
Edice:Applied Sciences
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On-line přístup:https://www.mdpi.com/2076-3417/13/3/1401