Research on the microwave interconnection technology of multifunctional components based on multi-layer PCB
In order to solve the difficulty of high density interconnection of multi-chip modules, a kind of microwave interconnection structure based on composite multi-layer printed circuit board(PCB) technology is designed.The optimized multi-layer interconnected structure is only 0.1 dB larger than the ins...
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| Format: | Article |
| Language: | zho |
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National Computer System Engineering Research Institute of China
2019-06-01
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| Series: | Dianzi Jishu Yingyong |
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| Online Access: | http://www.chinaaet.com/article/3000102893 |
| Summary: | In order to solve the difficulty of high density interconnection of multi-chip modules, a kind of microwave interconnection structure based on composite multi-layer printed circuit board(PCB) technology is designed.The optimized multi-layer interconnected structure is only 0.1 dB larger than the insertion loss of ideal microstrip in the 10 GHz～20 GHz, and the VSWR is 0.3. In the 30 GHz～40 GHz range, it is only 0.3 dB larger than the insertion loss of the ideal microstrip, and the VSWR is 0.4, which has good microwave characteristics. This structure has the advantages of simple design and low cost, which can solve the problem of high density interconnection of components. |
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| ISSN: | 0258-7998 |