Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio
Flow boiling heat transfer in microchannels can provide a high cooling rate, while maintaining a uniform wall temperature, which has been extensively studied as an attractive solution for the thermal management of high-power electronics. The depth-to-width ratio of the microchannel is an important p...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-05-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/13/11/2689 |
| _version_ | 1797566974590451712 |
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| author | Liang Chen Xingchen Li Runfeng Xiao Kunpeng Lv Xue Yang Yu Hou |
| author_facet | Liang Chen Xingchen Li Runfeng Xiao Kunpeng Lv Xue Yang Yu Hou |
| author_sort | Liang Chen |
| collection | DOAJ |
| description | Flow boiling heat transfer in microchannels can provide a high cooling rate, while maintaining a uniform wall temperature, which has been extensively studied as an attractive solution for the thermal management of high-power electronics. The depth-to-width ratio of the microchannel is an important parameter, which not only determines the heat transfer area but also has dominant effect on the heat transfer mechanisms. In the present study, numerical simulations based on the volume of fraction models are performed on the flow boiling in very deep microchannels. The effects of the depth-to-width ratio on the heat transfer coefficient and pressure drop are discussed. The bubble behavior and heat transfer characteristics are analyzed to explain the mechanism of heat transfer enhancement. The results show the very deep microchannels can effectively enhance the heat transfer, lower the temperature rise and show promising applications in the thermal management of high-power electronics. |
| first_indexed | 2024-03-10T19:35:04Z |
| format | Article |
| id | doaj.art-cccf749fd26f4e6db214a9c757957d1f |
| institution | Directory Open Access Journal |
| issn | 1996-1073 |
| language | English |
| last_indexed | 2024-03-10T19:35:04Z |
| publishDate | 2020-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj.art-cccf749fd26f4e6db214a9c757957d1f2023-11-20T01:51:32ZengMDPI AGEnergies1996-10732020-05-011311268910.3390/en13112689Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect RatioLiang Chen0Xingchen Li1Runfeng Xiao2Kunpeng Lv3Xue Yang4Yu Hou5State Key Laboratory of Multiphase Flow in Power Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaState Key Laboratory of Multiphase Flow in Power Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaState Key Laboratory of Multiphase Flow in Power Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaScience and Technology on Solid State Laser Laboratory, The 11th Research Institute of China Electronics Technology Group Corporation, Beijing 100015, ChinaScience and Technology on Solid State Laser Laboratory, The 11th Research Institute of China Electronics Technology Group Corporation, Beijing 100015, ChinaState Key Laboratory of Multiphase Flow in Power Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaFlow boiling heat transfer in microchannels can provide a high cooling rate, while maintaining a uniform wall temperature, which has been extensively studied as an attractive solution for the thermal management of high-power electronics. The depth-to-width ratio of the microchannel is an important parameter, which not only determines the heat transfer area but also has dominant effect on the heat transfer mechanisms. In the present study, numerical simulations based on the volume of fraction models are performed on the flow boiling in very deep microchannels. The effects of the depth-to-width ratio on the heat transfer coefficient and pressure drop are discussed. The bubble behavior and heat transfer characteristics are analyzed to explain the mechanism of heat transfer enhancement. The results show the very deep microchannels can effectively enhance the heat transfer, lower the temperature rise and show promising applications in the thermal management of high-power electronics.https://www.mdpi.com/1996-1073/13/11/2689flow boilingheat sinkmicrochannelnumerical simulation |
| spellingShingle | Liang Chen Xingchen Li Runfeng Xiao Kunpeng Lv Xue Yang Yu Hou Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio Energies flow boiling heat sink microchannel numerical simulation |
| title | Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio |
| title_full | Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio |
| title_fullStr | Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio |
| title_full_unstemmed | Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio |
| title_short | Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio |
| title_sort | flow boiling of low pressure water in microchannels of large aspect ratio |
| topic | flow boiling heat sink microchannel numerical simulation |
| url | https://www.mdpi.com/1996-1073/13/11/2689 |
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