Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics Interposers
Most of the single-mode fiber-coupled grating couplers reported in the literature have been designed for upward directionality to perform wafer-scale testing of photonic-integrated circuits. A coupler designed for downward directionality can help in achieving a face-up electro-optic integration sche...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2019-01-01
|
| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8721090/ |
| _version_ | 1818556867211689984 |
|---|---|
| author | Nivesh Mangal Jeroen Missinne Geert Van Steenberge Joris Van Campenhout Bradley Snyder |
| author_facet | Nivesh Mangal Jeroen Missinne Geert Van Steenberge Joris Van Campenhout Bradley Snyder |
| author_sort | Nivesh Mangal |
| collection | DOAJ |
| description | Most of the single-mode fiber-coupled grating couplers reported in the literature have been designed for upward directionality to perform wafer-scale testing of photonic-integrated circuits. A coupler designed for downward directionality can help in achieving a face-up electro-optic integration scheme for chip-to-board coupling using 2.5-D/3-D silicon photonics interposers. We demonstrate for the first time the design analysis and coupling performance of TE-polarized O-band through-substrate (backside emitting) grating couplers that have been optimized to produce enhanced directionality in the downward direction into the bulk silicon substrate of a Si photonics chip. The chip substrate was thinned and polished to achieve a bulk silicon thickness of 100 μm. By the use of an optimized reflector and an optimal thickness of anti-reflection coating at the backside of the chip, a -2.3 and -1.7 dB fiber-to-grating coupling efficiency has been measured when coupled through-substrate to a single-mode and multimode fiber, respectively. These gratings with downward directionality can help provide an efficient and alignment-tolerant interface for chip-to-chip or chip-to-board optical interconnects. |
| first_indexed | 2024-12-13T23:52:46Z |
| format | Article |
| id | doaj.art-cd35ea456ccb4c5f95cd1ff3f4f11cc7 |
| institution | Directory Open Access Journal |
| issn | 1943-0655 |
| language | English |
| last_indexed | 2024-12-13T23:52:46Z |
| publishDate | 2019-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Photonics Journal |
| spelling | doaj.art-cd35ea456ccb4c5f95cd1ff3f4f11cc72022-12-21T23:26:43ZengIEEEIEEE Photonics Journal1943-06552019-01-0111311110.1109/JPHOT.2019.29185228721090Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics InterposersNivesh Mangal0https://orcid.org/0000-0002-7211-8847Jeroen Missinne1https://orcid.org/0000-0002-3470-620XGeert Van Steenberge2https://orcid.org/0000-0001-8574-1235Joris Van Campenhout3https://orcid.org/0000-0003-0778-2669Bradley Snyder4Centre for Microsystems Technology, imec, Heverlee, BelgiumCentre for Microsystems Technology, imec, Heverlee, BelgiumCentre for Microsystems Technology, imec, Heverlee, Belgiumimec, Heverlee, Belgiumimec, Heverlee, BelgiumMost of the single-mode fiber-coupled grating couplers reported in the literature have been designed for upward directionality to perform wafer-scale testing of photonic-integrated circuits. A coupler designed for downward directionality can help in achieving a face-up electro-optic integration scheme for chip-to-board coupling using 2.5-D/3-D silicon photonics interposers. We demonstrate for the first time the design analysis and coupling performance of TE-polarized O-band through-substrate (backside emitting) grating couplers that have been optimized to produce enhanced directionality in the downward direction into the bulk silicon substrate of a Si photonics chip. The chip substrate was thinned and polished to achieve a bulk silicon thickness of 100 μm. By the use of an optimized reflector and an optimal thickness of anti-reflection coating at the backside of the chip, a -2.3 and -1.7 dB fiber-to-grating coupling efficiency has been measured when coupled through-substrate to a single-mode and multimode fiber, respectively. These gratings with downward directionality can help provide an efficient and alignment-tolerant interface for chip-to-chip or chip-to-board optical interconnects.https://ieeexplore.ieee.org/document/8721090/Grating couplersoptical interconnectsoptical interposerssilicon photonics |
| spellingShingle | Nivesh Mangal Jeroen Missinne Geert Van Steenberge Joris Van Campenhout Bradley Snyder Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics Interposers IEEE Photonics Journal Grating couplers optical interconnects optical interposers silicon photonics |
| title | Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics Interposers |
| title_full | Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics Interposers |
| title_fullStr | Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics Interposers |
| title_full_unstemmed | Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics Interposers |
| title_short | Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m-Thick Silicon Photonics Interposers |
| title_sort | performance evaluation of backside emitting o band grating couplers for 100 inline formula tex math notation latex mu tex math inline formula m thick silicon photonics interposers |
| topic | Grating couplers optical interconnects optical interposers silicon photonics |
| url | https://ieeexplore.ieee.org/document/8721090/ |
| work_keys_str_mv | AT niveshmangal performanceevaluationofbacksideemittingobandgratingcouplersfor100inlineformulatexmathnotationlatexmutexmathinlineformulamthicksiliconphotonicsinterposers AT jeroenmissinne performanceevaluationofbacksideemittingobandgratingcouplersfor100inlineformulatexmathnotationlatexmutexmathinlineformulamthicksiliconphotonicsinterposers AT geertvansteenberge performanceevaluationofbacksideemittingobandgratingcouplersfor100inlineformulatexmathnotationlatexmutexmathinlineformulamthicksiliconphotonicsinterposers AT jorisvancampenhout performanceevaluationofbacksideemittingobandgratingcouplersfor100inlineformulatexmathnotationlatexmutexmathinlineformulamthicksiliconphotonicsinterposers AT bradleysnyder performanceevaluationofbacksideemittingobandgratingcouplersfor100inlineformulatexmathnotationlatexmutexmathinlineformulamthicksiliconphotonicsinterposers |