Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices
To obtain high-frequency SAW devices, the interdigital transducer electrodes are prepared narrower and the electrode spacing is smaller, which leads to higher cost and lower reliability of high-frequency SAW devices. In this paper, two other interdigital electrode parallel layout structures are desi...
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IEEE
2024-01-01
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Series: | IEEE Access |
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Online Access: | https://ieeexplore.ieee.org/document/10477622/ |
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author | Xu Meng Zhipeng Li |
author_facet | Xu Meng Zhipeng Li |
author_sort | Xu Meng |
collection | DOAJ |
description | To obtain high-frequency SAW devices, the interdigital transducer electrodes are prepared narrower and the electrode spacing is smaller, which leads to higher cost and lower reliability of high-frequency SAW devices. In this paper, two other interdigital electrode parallel layout structures are designed based on the traditional IDT flat layer layout structure, and the influence of the three different IDT electrode layout structures on the SAW device of LiNbO3/Diamond/Si multilayer structure is studied by COMSOL Multiphysics. The results show that the designed multi-layer structure SAW device can successfully excite SAW with superior performance, and the parallel layout structure of the interdigital electrode can reduce the lateral size of SAW device, which provides a new idea and direction for the miniaturization of the SAW devices. |
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id | doaj.art-cd8f4aea88844c04ac79dc863dad9346 |
institution | Directory Open Access Journal |
issn | 2169-3536 |
language | English |
last_indexed | 2024-04-24T17:42:10Z |
publishDate | 2024-01-01 |
publisher | IEEE |
record_format | Article |
series | IEEE Access |
spelling | doaj.art-cd8f4aea88844c04ac79dc863dad93462024-03-27T23:00:35ZengIEEEIEEE Access2169-35362024-01-0112434534345910.1109/ACCESS.2024.338037010477622Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW DevicesXu Meng0https://orcid.org/0000-0002-2219-2838Zhipeng Li1College of Automotive Engineering, Changzhou Institute of Technology, Changzhou, ChinaSchool of Traffic and Transportation, Northeast Forestry University, Harbin, ChinaTo obtain high-frequency SAW devices, the interdigital transducer electrodes are prepared narrower and the electrode spacing is smaller, which leads to higher cost and lower reliability of high-frequency SAW devices. In this paper, two other interdigital electrode parallel layout structures are designed based on the traditional IDT flat layer layout structure, and the influence of the three different IDT electrode layout structures on the SAW device of LiNbO3/Diamond/Si multilayer structure is studied by COMSOL Multiphysics. The results show that the designed multi-layer structure SAW device can successfully excite SAW with superior performance, and the parallel layout structure of the interdigital electrode can reduce the lateral size of SAW device, which provides a new idea and direction for the miniaturization of the SAW devices.https://ieeexplore.ieee.org/document/10477622/Design optimizationfinite element analysis (FEA)interdigital transducer (IDT)multilayer structuresurface acoustic wave (SAW) |
spellingShingle | Xu Meng Zhipeng Li Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices IEEE Access Design optimization finite element analysis (FEA) interdigital transducer (IDT) multilayer structure surface acoustic wave (SAW) |
title | Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices |
title_full | Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices |
title_fullStr | Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices |
title_full_unstemmed | Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices |
title_short | Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices |
title_sort | design and analysis of interdigital electrode parallel layout of multilayer saw devices |
topic | Design optimization finite element analysis (FEA) interdigital transducer (IDT) multilayer structure surface acoustic wave (SAW) |
url | https://ieeexplore.ieee.org/document/10477622/ |
work_keys_str_mv | AT xumeng designandanalysisofinterdigitalelectrodeparallellayoutofmultilayersawdevices AT zhipengli designandanalysisofinterdigitalelectrodeparallellayoutofmultilayersawdevices |