Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices

To obtain high-frequency SAW devices, the interdigital transducer electrodes are prepared narrower and the electrode spacing is smaller, which leads to higher cost and lower reliability of high-frequency SAW devices. In this paper, two other interdigital electrode parallel layout structures are desi...

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Main Authors: Xu Meng, Zhipeng Li
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10477622/
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author Xu Meng
Zhipeng Li
author_facet Xu Meng
Zhipeng Li
author_sort Xu Meng
collection DOAJ
description To obtain high-frequency SAW devices, the interdigital transducer electrodes are prepared narrower and the electrode spacing is smaller, which leads to higher cost and lower reliability of high-frequency SAW devices. In this paper, two other interdigital electrode parallel layout structures are designed based on the traditional IDT flat layer layout structure, and the influence of the three different IDT electrode layout structures on the SAW device of LiNbO3/Diamond/Si multilayer structure is studied by COMSOL Multiphysics. The results show that the designed multi-layer structure SAW device can successfully excite SAW with superior performance, and the parallel layout structure of the interdigital electrode can reduce the lateral size of SAW device, which provides a new idea and direction for the miniaturization of the SAW devices.
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spelling doaj.art-cd8f4aea88844c04ac79dc863dad93462024-03-27T23:00:35ZengIEEEIEEE Access2169-35362024-01-0112434534345910.1109/ACCESS.2024.338037010477622Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW DevicesXu Meng0https://orcid.org/0000-0002-2219-2838Zhipeng Li1College of Automotive Engineering, Changzhou Institute of Technology, Changzhou, ChinaSchool of Traffic and Transportation, Northeast Forestry University, Harbin, ChinaTo obtain high-frequency SAW devices, the interdigital transducer electrodes are prepared narrower and the electrode spacing is smaller, which leads to higher cost and lower reliability of high-frequency SAW devices. In this paper, two other interdigital electrode parallel layout structures are designed based on the traditional IDT flat layer layout structure, and the influence of the three different IDT electrode layout structures on the SAW device of LiNbO3/Diamond/Si multilayer structure is studied by COMSOL Multiphysics. The results show that the designed multi-layer structure SAW device can successfully excite SAW with superior performance, and the parallel layout structure of the interdigital electrode can reduce the lateral size of SAW device, which provides a new idea and direction for the miniaturization of the SAW devices.https://ieeexplore.ieee.org/document/10477622/Design optimizationfinite element analysis (FEA)interdigital transducer (IDT)multilayer structuresurface acoustic wave (SAW)
spellingShingle Xu Meng
Zhipeng Li
Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices
IEEE Access
Design optimization
finite element analysis (FEA)
interdigital transducer (IDT)
multilayer structure
surface acoustic wave (SAW)
title Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices
title_full Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices
title_fullStr Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices
title_full_unstemmed Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices
title_short Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices
title_sort design and analysis of interdigital electrode parallel layout of multilayer saw devices
topic Design optimization
finite element analysis (FEA)
interdigital transducer (IDT)
multilayer structure
surface acoustic wave (SAW)
url https://ieeexplore.ieee.org/document/10477622/
work_keys_str_mv AT xumeng designandanalysisofinterdigitalelectrodeparallellayoutofmultilayersawdevices
AT zhipengli designandanalysisofinterdigitalelectrodeparallellayoutofmultilayersawdevices