MONITORING OF IC ENCAPSULATION PROCESS
High reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Belarusian National Technical University
2015-03-01
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| Series: | Pribory i Metody Izmerenij |
| Subjects: | |
| Online Access: | https://pimi.bntu.by/jour/article/view/25 |
| _version_ | 1797874920256962560 |
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| author | V. A. Saladukha V. S. Turtsevitch J. A. Solovjov I. I. Rubtsevitch A. F. Kerentsev A. A. Dovzhenko I. V. Chirko |
| author_facet | V. A. Saladukha V. S. Turtsevitch J. A. Solovjov I. I. Rubtsevitch A. F. Kerentsev A. A. Dovzhenko I. V. Chirko |
| author_sort | V. A. Saladukha |
| collection | DOAJ |
| description | High reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the conditions of contact welding and the instruments for complex measurements of parameters of the ambient environment of the encapsulation system has allowed to provide a continuous monitoring of the process parameters: welding current, temperature, dew point and relative humidity of an inert ambient environment. As the result of seam welding, increase of yield fitted in hermeticity over 99,0 % and decrease the moisture content inside the IC package to vol. 0,01–0,2 % has been reached. |
| first_indexed | 2024-04-10T01:38:32Z |
| format | Article |
| id | doaj.art-cdcd1878acf6416281389e4e656e12c9 |
| institution | Directory Open Access Journal |
| issn | 2220-9506 2414-0473 |
| language | English |
| last_indexed | 2024-04-10T01:38:32Z |
| publishDate | 2015-03-01 |
| publisher | Belarusian National Technical University |
| record_format | Article |
| series | Pribory i Metody Izmerenij |
| spelling | doaj.art-cdcd1878acf6416281389e4e656e12c92023-03-13T09:14:44ZengBelarusian National Technical UniversityPribory i Metody Izmerenij2220-95062414-04732015-03-010110310719MONITORING OF IC ENCAPSULATION PROCESSV. A. Saladukha0V. S. Turtsevitch1J. A. Solovjov2I. I. Rubtsevitch3A. F. Kerentsev4A. A. Dovzhenko5I. V. Chirko6«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. МинскHigh reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the conditions of contact welding and the instruments for complex measurements of parameters of the ambient environment of the encapsulation system has allowed to provide a continuous monitoring of the process parameters: welding current, temperature, dew point and relative humidity of an inert ambient environment. As the result of seam welding, increase of yield fitted in hermeticity over 99,0 % and decrease the moisture content inside the IC package to vol. 0,01–0,2 % has been reached.https://pimi.bntu.by/jour/article/view/25интегральная схемавлагамониторинг |
| spellingShingle | V. A. Saladukha V. S. Turtsevitch J. A. Solovjov I. I. Rubtsevitch A. F. Kerentsev A. A. Dovzhenko I. V. Chirko MONITORING OF IC ENCAPSULATION PROCESS Pribory i Metody Izmerenij интегральная схема влага мониторинг |
| title | MONITORING OF IC ENCAPSULATION PROCESS |
| title_full | MONITORING OF IC ENCAPSULATION PROCESS |
| title_fullStr | MONITORING OF IC ENCAPSULATION PROCESS |
| title_full_unstemmed | MONITORING OF IC ENCAPSULATION PROCESS |
| title_short | MONITORING OF IC ENCAPSULATION PROCESS |
| title_sort | monitoring of ic encapsulation process |
| topic | интегральная схема влага мониторинг |
| url | https://pimi.bntu.by/jour/article/view/25 |
| work_keys_str_mv | AT vasaladukha monitoringoficencapsulationprocess AT vsturtsevitch monitoringoficencapsulationprocess AT jasolovjov monitoringoficencapsulationprocess AT iirubtsevitch monitoringoficencapsulationprocess AT afkerentsev monitoringoficencapsulationprocess AT aadovzhenko monitoringoficencapsulationprocess AT ivchirko monitoringoficencapsulationprocess |