Linker engineering of larger POSS-based ultra-low-k dielectrics toward outstanding comprehensive properties

Linker engineering of larger POSS-based ultra-low-k dielectrics toward outstanding comprehensive properties

Low-dielectric-constant (low-k) materials are an indispensable part of microprocessors as they can alleviate electronic crosstalk, charge build-up, and signal propagation delay. However, existing low-k materials usually have k values higher than 2 and inferior thermo-mechanical properties, which res...

Full description

Bibliographic Details
Main Authors: Dai-Lin Zhou, Xing Wang, Wei-Cheng Qu, Qing-Yun Guo, Chen-Yu Li, Qin Zhang, Di Han, Qiang Fu
Format: Article
Language:English
Published: Elsevier 2023-06-01
Series:Giant
Subjects:
Low-k dielectrics
Polyhedral oligomeric silsesquioxane
Hybrid materials
Free volume
Thermosets
Online Access:http://www.sciencedirect.com/science/article/pii/S2666542523000085

Internet

http://www.sciencedirect.com/science/article/pii/S2666542523000085

Similar Items