Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths
Monocrystalline silicon is widely used in the semiconductor market, but its hard and brittle physical properties make processing difficult. Fixed-diamond abrasive wire-saw (FAW) cutting is currently the most commonly used cutting method for hard and brittle materials due to advantages such as narrow...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-06-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/6/1275 |
| _version_ | 1827736370503745536 |
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| author | Lie Liang Shujuan Li Kehao Lan Jiabin Wang Ruijiang Yu |
| author_facet | Lie Liang Shujuan Li Kehao Lan Jiabin Wang Ruijiang Yu |
| author_sort | Lie Liang |
| collection | DOAJ |
| description | Monocrystalline silicon is widely used in the semiconductor market, but its hard and brittle physical properties make processing difficult. Fixed-diamond abrasive wire-saw (FAW) cutting is currently the most commonly used cutting method for hard and brittle materials due to advantages such as narrow cutting seams, low pollution, low cutting force and simple cutting process. During the process of cutting a wafer, the contact between the part and the wire is curved, and the arc length changes during the cutting process. This paper establishes a model of contact arc length by analyzing the cutting system. At the same time, a model of the random distribution of abrasive particles is established to solve the cutting force during the cutting process, using iterative algorithms to calculate cutting forces and chip surface saw marks. The error between the experiment and simulation of the average cutting force in the stable stage is less than 6%, and the errors with respect to the central angle and curvature of the saw arc on the wafer surface are less than 5% between the experiment and simulation. The relationship between the bow angle, contact arc length and cutting parameters is studied using simulations. The results show that the variation trend of the bow angle and contact arc length is consistent, increasing with an increase in the part feed rate and decreasing with an increase in the wire velocity. |
| first_indexed | 2024-03-11T02:08:40Z |
| format | Article |
| id | doaj.art-cdf0308e34044119b81daccf360cee9e |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-11T02:08:40Z |
| publishDate | 2023-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-cdf0308e34044119b81daccf360cee9e2023-11-18T11:40:48ZengMDPI AGMicromachines2072-666X2023-06-01146127510.3390/mi14061275Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc LengthsLie Liang0Shujuan Li1Kehao Lan2Jiabin Wang3Ruijiang Yu4School of Mechanical and Precision Instrument Engineering, Xi’an University of Technology, Xi’an 710048, ChinaSchool of Mechanical and Precision Instrument Engineering, Xi’an University of Technology, Xi’an 710048, ChinaSchool of Mechanical and Precision Instrument Engineering, Xi’an University of Technology, Xi’an 710048, ChinaSchool of Mechanical and Precision Instrument Engineering, Xi’an University of Technology, Xi’an 710048, ChinaSchool of Mechanical and Precision Instrument Engineering, Xi’an University of Technology, Xi’an 710048, ChinaMonocrystalline silicon is widely used in the semiconductor market, but its hard and brittle physical properties make processing difficult. Fixed-diamond abrasive wire-saw (FAW) cutting is currently the most commonly used cutting method for hard and brittle materials due to advantages such as narrow cutting seams, low pollution, low cutting force and simple cutting process. During the process of cutting a wafer, the contact between the part and the wire is curved, and the arc length changes during the cutting process. This paper establishes a model of contact arc length by analyzing the cutting system. At the same time, a model of the random distribution of abrasive particles is established to solve the cutting force during the cutting process, using iterative algorithms to calculate cutting forces and chip surface saw marks. The error between the experiment and simulation of the average cutting force in the stable stage is less than 6%, and the errors with respect to the central angle and curvature of the saw arc on the wafer surface are less than 5% between the experiment and simulation. The relationship between the bow angle, contact arc length and cutting parameters is studied using simulations. The results show that the variation trend of the bow angle and contact arc length is consistent, increasing with an increase in the part feed rate and decreasing with an increase in the wire velocity.https://www.mdpi.com/2072-666X/14/6/1275contact arc lengthcutting forcerandom distribution of abrasive particleswire bow angle |
| spellingShingle | Lie Liang Shujuan Li Kehao Lan Jiabin Wang Ruijiang Yu Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths Micromachines contact arc length cutting force random distribution of abrasive particles wire bow angle |
| title | Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths |
| title_full | Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths |
| title_fullStr | Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths |
| title_full_unstemmed | Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths |
| title_short | Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths |
| title_sort | fixed diamond abrasive wire saw cutting force modeling based on changes in contact arc lengths |
| topic | contact arc length cutting force random distribution of abrasive particles wire bow angle |
| url | https://www.mdpi.com/2072-666X/14/6/1275 |
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