An Assembly Quality Inspection System for Bone Conduction Implant Transducers
We designed and implemented a two-axis measurement system to inspect the assembly quality condition of a bone conduction implant (BCI) transducer. The system consists of a laser Doppler vibrometer (LDV), XY manual stage, and two digital scale calipers capable of displaying a position coordinate syst...
Main Authors: | Dong Ho Shin, Hui-Sup Cho |
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Format: | Article |
Language: | English |
Published: |
IEEE
2021-01-01
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Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9493195/ |
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