Crosstalk study on transmission lines of embedded substrate
Five process parameters of the embedded substrate, the width of transmission line, the thickness of transmission line, coupling length of transmission lines, the distance between transmission line and substrate dielectric constant were chosed as control factors. By establishing five factors and four...
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Format: | Article |
Language: | zho |
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National Computer System Engineering Research Institute of China
2018-01-01
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Series: | Dianzi Jishu Yingyong |
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Online Access: | http://www.chinaaet.com/article/3000075781 |
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author | Huang Wei Huang Chunyue Zhai Jianghui |
author_facet | Huang Wei Huang Chunyue Zhai Jianghui |
author_sort | Huang Wei |
collection | DOAJ |
description | Five process parameters of the embedded substrate, the width of transmission line, the thickness of transmission line, coupling length of transmission lines, the distance between transmission line and substrate dielectric constant were chosed as control factors. By establishing five factors and four levels orthogonal experiment table with 16 parameter levels , cross talk between transmission lines was analyzed. The results show that the distance between transmission lines is the greatest influence on the crosstalk, then the coupling length of transmission lines, and the substrate dielectric constant, the width of transmission line and transmission line thickness have little influence on the crosstalk. The optimal parameter combination is W4T4S4L1D1 with the transmission line width of 15 mil, the transmission line thickness of 70 μm, transmission line coupling distance of 2 mm, coupling length of 5 mm, a dielectric constant of 4.3. |
first_indexed | 2024-12-23T14:01:08Z |
format | Article |
id | doaj.art-ce11a9e7c188433099383b18e29cc34c |
institution | Directory Open Access Journal |
issn | 0258-7998 |
language | zho |
last_indexed | 2024-12-23T14:01:08Z |
publishDate | 2018-01-01 |
publisher | National Computer System Engineering Research Institute of China |
record_format | Article |
series | Dianzi Jishu Yingyong |
spelling | doaj.art-ce11a9e7c188433099383b18e29cc34c2022-12-21T17:44:18ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982018-01-01441131610.16157/j.issn.0258-7998.1721193000075781Crosstalk study on transmission lines of embedded substrateHuang Wei0Huang Chunyue1Zhai Jianghui2School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,ChinaSchool of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,ChinaSchool of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,ChinaFive process parameters of the embedded substrate, the width of transmission line, the thickness of transmission line, coupling length of transmission lines, the distance between transmission line and substrate dielectric constant were chosed as control factors. By establishing five factors and four levels orthogonal experiment table with 16 parameter levels , cross talk between transmission lines was analyzed. The results show that the distance between transmission lines is the greatest influence on the crosstalk, then the coupling length of transmission lines, and the substrate dielectric constant, the width of transmission line and transmission line thickness have little influence on the crosstalk. The optimal parameter combination is W4T4S4L1D1 with the transmission line width of 15 mil, the transmission line thickness of 70 μm, transmission line coupling distance of 2 mm, coupling length of 5 mm, a dielectric constant of 4.3.http://www.chinaaet.com/article/3000075781embedded substratetransmission linecrosstalkorthogonal design |
spellingShingle | Huang Wei Huang Chunyue Zhai Jianghui Crosstalk study on transmission lines of embedded substrate Dianzi Jishu Yingyong embedded substrate transmission line crosstalk orthogonal design |
title | Crosstalk study on transmission lines of embedded substrate |
title_full | Crosstalk study on transmission lines of embedded substrate |
title_fullStr | Crosstalk study on transmission lines of embedded substrate |
title_full_unstemmed | Crosstalk study on transmission lines of embedded substrate |
title_short | Crosstalk study on transmission lines of embedded substrate |
title_sort | crosstalk study on transmission lines of embedded substrate |
topic | embedded substrate transmission line crosstalk orthogonal design |
url | http://www.chinaaet.com/article/3000075781 |
work_keys_str_mv | AT huangwei crosstalkstudyontransmissionlinesofembeddedsubstrate AT huangchunyue crosstalkstudyontransmissionlinesofembeddedsubstrate AT zhaijianghui crosstalkstudyontransmissionlinesofembeddedsubstrate |