Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide System

For the first time, an alternative way of improving the stability of Cu-based thermoelectric materials is proposed, with the investigation of two different copper chalcogenide–copper tetrahedrite composites, rich in sulfur and selenium anions, respectively. Based on the preliminary DFT results, whic...

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Main Authors: Andrzej Mikuła, Krzysztof Mars, Paweł Nieroda, Paweł Rutkowski
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/10/2635
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author Andrzej Mikuła
Krzysztof Mars
Paweł Nieroda
Paweł Rutkowski
author_facet Andrzej Mikuła
Krzysztof Mars
Paweł Nieroda
Paweł Rutkowski
author_sort Andrzej Mikuła
collection DOAJ
description For the first time, an alternative way of improving the stability of Cu-based thermoelectric materials is proposed, with the investigation of two different copper chalcogenide–copper tetrahedrite composites, rich in sulfur and selenium anions, respectively. Based on the preliminary DFT results, which indicate the instability of Sb-doped copper chalcogenide, the Cu<sub>1.97</sub>S–Cu<sub>12</sub>Sb<sub>4</sub>S<sub>13</sub> and Cu<sub>2−x</sub>Se–Cu<sub>3</sub>SbSe<sub>3</sub> composites are obtained using melt-solidification techniques, with the tetrahedrite phase concentration varying from 1 to 10 wt.%. Room temperature structural analysis (XRD, SEM) indicates the two-phase structure of the materials, with ternary phase precipitates embed within the copper chalcogenide matrix. The proposed solution allows for successful blocking of excessive Cu migration, with stable electrical conductivity and Seebeck coefficient values over subsequent thermal cycles. The materials exhibit a p-type, semimetallic character with high stability, represented by a near-constant power factor (PF)—temperature dependences between individual cycles. Finally, the thermoelectric figure-of-merit ZT parameter reaches about 0.26 (623 K) for the Cu<sub>1.97</sub>S–Cu<sub>12</sub>Sb<sub>4</sub>S<sub>13</sub> system, in which case increasing content of tetrahedrite is a beneficial effect, and about 0.44 (623 K) for the Cu<sub>2−x</sub>Se–Cu<sub>3</sub>SbSe<sub>3</sub> system, where increasing the content of Cu<sub>3</sub>SbSe<sub>3</sub> negatively influences the thermoelectric performance.
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spelling doaj.art-cedab2299d344bbd9ce33cd7eaecef752023-11-21T20:13:55ZengMDPI AGMaterials1996-19442021-05-011410263510.3390/ma14102635Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide SystemAndrzej Mikuła0Krzysztof Mars1Paweł Nieroda2Paweł Rutkowski3Faculty of Materials Science and Ceramics, AGH University of Science and Technology, Al. Mickiewicza 30, 30-059 Krakow, PolandFaculty of Materials Science and Ceramics, AGH University of Science and Technology, Al. Mickiewicza 30, 30-059 Krakow, PolandFaculty of Materials Science and Ceramics, AGH University of Science and Technology, Al. Mickiewicza 30, 30-059 Krakow, PolandFaculty of Materials Science and Ceramics, AGH University of Science and Technology, Al. Mickiewicza 30, 30-059 Krakow, PolandFor the first time, an alternative way of improving the stability of Cu-based thermoelectric materials is proposed, with the investigation of two different copper chalcogenide–copper tetrahedrite composites, rich in sulfur and selenium anions, respectively. Based on the preliminary DFT results, which indicate the instability of Sb-doped copper chalcogenide, the Cu<sub>1.97</sub>S–Cu<sub>12</sub>Sb<sub>4</sub>S<sub>13</sub> and Cu<sub>2−x</sub>Se–Cu<sub>3</sub>SbSe<sub>3</sub> composites are obtained using melt-solidification techniques, with the tetrahedrite phase concentration varying from 1 to 10 wt.%. Room temperature structural analysis (XRD, SEM) indicates the two-phase structure of the materials, with ternary phase precipitates embed within the copper chalcogenide matrix. The proposed solution allows for successful blocking of excessive Cu migration, with stable electrical conductivity and Seebeck coefficient values over subsequent thermal cycles. The materials exhibit a p-type, semimetallic character with high stability, represented by a near-constant power factor (PF)—temperature dependences between individual cycles. Finally, the thermoelectric figure-of-merit ZT parameter reaches about 0.26 (623 K) for the Cu<sub>1.97</sub>S–Cu<sub>12</sub>Sb<sub>4</sub>S<sub>13</sub> system, in which case increasing content of tetrahedrite is a beneficial effect, and about 0.44 (623 K) for the Cu<sub>2−x</sub>Se–Cu<sub>3</sub>SbSe<sub>3</sub> system, where increasing the content of Cu<sub>3</sub>SbSe<sub>3</sub> negatively influences the thermoelectric performance.https://www.mdpi.com/1996-1944/14/10/2635compositecopper chalcogenidetetrahedritethermoelectrics
spellingShingle Andrzej Mikuła
Krzysztof Mars
Paweł Nieroda
Paweł Rutkowski
Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide System
Materials
composite
copper chalcogenide
tetrahedrite
thermoelectrics
title Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide System
title_full Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide System
title_fullStr Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide System
title_full_unstemmed Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide System
title_short Copper Chalcogenide–Copper Tetrahedrite Composites—A New Concept for Stable Thermoelectric Materials Based on the Chalcogenide System
title_sort copper chalcogenide copper tetrahedrite composites a new concept for stable thermoelectric materials based on the chalcogenide system
topic composite
copper chalcogenide
tetrahedrite
thermoelectrics
url https://www.mdpi.com/1996-1944/14/10/2635
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AT pawełnieroda copperchalcogenidecoppertetrahedritecompositesanewconceptforstablethermoelectricmaterialsbasedonthechalcogenidesystem
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