Mathematical modeling of heat transfer in the film-substrate-thermostat system during heating of an electrically conductive film by a high-density pulse current

Mathematical modeling of heat transfer in the film-substrate-thermostat system with a pulsed flow of high-density current through an electrically conductive film has been carried out. On the basis of the simulation, the analysis of the heating of a niobium nitride film with a high resistivity near t...

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Bibliographic Details
Main Authors: Kuzmichev Nikolay D., Vasyutin Mikhael A., Danilova Ekaterina V., Lapshina Elena A.
Format: Article
Language:English
Published: National Research Mordovia State University 2021-02-01
Series:Журнал Средневолжского математического общества
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Online Access:http://journal.svmo.ru/en/archive/article?id=1717
Description
Summary:Mathematical modeling of heat transfer in the film-substrate-thermostat system with a pulsed flow of high-density current through an electrically conductive film has been carried out. On the basis of the simulation, the analysis of the heating of a niobium nitride film with a high resistivity near the critical temperature of the transition to the superconducting state is made. The inhomogeneous heat conduction equation which is solved numerically, simulates heat transfer in the film-substrate-thermostat system for the third on the left and the first on the right initial boundary value problem. Using the symmetry of the problem, the parameter $H$ is determined, which is equal to the ratio of the heat transfer of the film surface to its thermal conductivity; this parameter is necessary for effective heat removal. It is shown that effective heat removal from films can be provided by current-carrying and potential clamping contacts made, for example, of beryllium bronze. This makes possible to study the current-voltage characteristics of superconductors near the critical transition temperature to the superconducting state with high-density currents $(10^4 - 10^5 A/cm^2)$ without significant heating of the samples.
ISSN:2079-6900
2587-7496