Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation

Composite systems of monolayer and multilayer nickel films electrochemically deposited on single crystal (100)-oriented silicon wafers were fabricated with and without the ultrasonic agitation. The hardness and adhesion behaviour of these composite structures were characterized by Vickers microinden...

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Main Authors: Lamovec Jelena, Jović Vesna, Jaćimovski Stevo, Jovanov Goran, Radojević Vesna, Šetrajčić Jovan
Format: Article
Language:English
Published: University of Criminal Investigation and Police Studies, Belgrade 2019-01-01
Series:NBP: Nauka, bezbednost, policija
Subjects:
Online Access:https://scindeks-clanci.ceon.rs/data/pdf/0354-8872/2019/0354-88721901017L.pdf
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author Lamovec Jelena
Jović Vesna
Jaćimovski Stevo
Jovanov Goran
Radojević Vesna
Šetrajčić Jovan
author_facet Lamovec Jelena
Jović Vesna
Jaćimovski Stevo
Jovanov Goran
Radojević Vesna
Šetrajčić Jovan
author_sort Lamovec Jelena
collection DOAJ
description Composite systems of monolayer and multilayer nickel films electrochemically deposited on single crystal (100)-oriented silicon wafers were fabricated with and without the ultrasonic agitation. The hardness and adhesion behaviour of these composite structures were characterized by Vickers microindentation test. The dependence of composite microhardness and film adhesion on the structure of the film and mixing conditions of electrolyte were analysed. Mathematical models of Chicot-Lesage and Chen-Gao were applied to experimental data in order to obtain the film hardness and adhesion parameter respectively. It is confirmed that the mechanical properties of composite systems of nickel thin films on silicon substrate can be enhanced by formation of multilayer film structure by ultrasound-assisted electro-deposition and by reducing the layer thickness in the multilayer film.
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spelling doaj.art-cf7ebfcb0f6643b88e0c7d83f2bc0b8b2022-12-21T18:29:04ZengUniversity of Criminal Investigation and Police Studies, BelgradeNBP: Nauka, bezbednost, policija0354-88722620-04062019-01-0124117290354-88721901017LHardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitationLamovec Jelena0Jović Vesna1Jaćimovski Stevo2Jovanov Goran3Radojević Vesna4Šetrajčić Jovan5University of Belgrade, Institute for Chemistry, Technology and Metallurgy, The Microelectronic Technologies DepartmentUniversity of Belgrade, Institute for Chemistry, Technology and Metallurgy, The Microelectronic Technologies DepartmentUniversity of Criminal Investigation and Police Studies, BelgradeUniversity of Criminal Investigation and Police Studies, BelgradeUniversity of Belgrade, Faculty of Technology and MetallurgyUniversity 'Union - Nikola Tesla', Faculty of SportComposite systems of monolayer and multilayer nickel films electrochemically deposited on single crystal (100)-oriented silicon wafers were fabricated with and without the ultrasonic agitation. The hardness and adhesion behaviour of these composite structures were characterized by Vickers microindentation test. The dependence of composite microhardness and film adhesion on the structure of the film and mixing conditions of electrolyte were analysed. Mathematical models of Chicot-Lesage and Chen-Gao were applied to experimental data in order to obtain the film hardness and adhesion parameter respectively. It is confirmed that the mechanical properties of composite systems of nickel thin films on silicon substrate can be enhanced by formation of multilayer film structure by ultrasound-assisted electro-deposition and by reducing the layer thickness in the multilayer film.https://scindeks-clanci.ceon.rs/data/pdf/0354-8872/2019/0354-88721901017L.pdfcomposite hardnessfilm adhesionultrasound-assisted electro-depositionmultilayer nickel films
spellingShingle Lamovec Jelena
Jović Vesna
Jaćimovski Stevo
Jovanov Goran
Radojević Vesna
Šetrajčić Jovan
Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
NBP: Nauka, bezbednost, policija
composite hardness
film adhesion
ultrasound-assisted electro-deposition
multilayer nickel films
title Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
title_full Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
title_fullStr Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
title_full_unstemmed Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
title_short Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
title_sort hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
topic composite hardness
film adhesion
ultrasound-assisted electro-deposition
multilayer nickel films
url https://scindeks-clanci.ceon.rs/data/pdf/0354-8872/2019/0354-88721901017L.pdf
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