Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

To realize the application of ultrafine-grained (UFG) materials in micro-forming, the micro/meso-deformation and fracture behavior of UFG pure copper processed using equal-channel angular pressing were analyzed by making in/ex-situ observations during tensile testing. The evolution of surface cracks...

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Bibliographic Details
Main Authors: Jianwei Li, Chaogang Ding, Wanji Chen, Debin Shan, Bin Guo, Jie Xu
Format: Article
Language:English
Published: Elsevier 2023-05-01
Series:Materials & Design
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127523002885
Description
Summary:To realize the application of ultrafine-grained (UFG) materials in micro-forming, the micro/meso-deformation and fracture behavior of UFG pure copper processed using equal-channel angular pressing were analyzed by making in/ex-situ observations during tensile testing. The evolution of surface cracks and inner voids was apparent in the in-situ scanning electron microscopy (SEM) images and synchrotron radiation X-ray tomograms, respectively. The results indicate that the surface-crack evolution of UFG pure copper can be correlated with strain localization when the flow stress decreases after peaking. The effects of grain size and shear texture on damage evolution during the fracture process are also discussed. This work comprehensively explores the plasticity and fracture/failure mechanisms in UFG Cu samples during the micro-forming process.
ISSN:0264-1275