| Summary: | Due to their high reliability, ease of manufacture, passive operation, and efficient heat transfer, vapor chambers (VC) are widely used for temperature management of modern electronic and power devices. This review considers all experimental works on the characterization of the thermal characteristics of VC, in the results of which the threshold in the removal of a specific heat flux of >0.1 kW/cm2 was overcome. This literature review, when compared with other cooling techniques, showed that they have not shown a noticeable increase in recent decades. Moreover, we should expect a qualitative increase in the capabilities of the VC and the expansion of their use. The principles of operation of modern VCs, often referred to as evaporation chambers, are also conceptually described.
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