Residual Stresses Control in Additive Manufacturing

Residual stresses are one of the primary causes for the failure of parts or systems in metal additive manufacturing (AM), since they easily induce crack propagation and structural distortion. Although the formation of residual stresses has been extensively studied, the core factors steering their de...

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Bibliographic Details
Main Authors: Xufei Lu, Miguel Cervera, Michele Chiumenti, Xin Lin
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Journal of Manufacturing and Materials Processing
Subjects:
Online Access:https://www.mdpi.com/2504-4494/5/4/138
Description
Summary:Residual stresses are one of the primary causes for the failure of parts or systems in metal additive manufacturing (AM), since they easily induce crack propagation and structural distortion. Although the formation of residual stresses has been extensively studied, the core factors steering their development in AM have not been completely uncovered. To date, several strategies based on reducing the thermal gradients have been developed to mitigate the manifestation of residual stresses in AM; however, how to choose the optimal processing plan is still unclear for AM designers. In this regard, the concept of the yield temperature, related to the thermal deformation and the mechanical constraint, plays a crucial role for controlling the residual stresses, but it has not been duly investigated, and the corresponding approach to control stresses is also yet lacking. To undertake such study, a three-bar model is firstly used to illustrate the formation mechanism of the residual stress and its key causes. Next, an experimentally calibrated thermomechanical finite element model is used to analyze the sensitivity of the residual stresses to the scan pattern, preheating, energy density, and the part geometry and size, as well as the substrate constraints. Based on the numerical results obtained from this analysis, recommendations on how to minimize the residual stresses during the AM process are provided.
ISSN:2504-4494