Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization
This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used as the sensing channel to transmit the ext...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-06-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/6/928 |
| _version_ | 1797484294348734464 |
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| author | Jun Liu Shanhong Xia Chunrong Peng Zhengwei Wu Zhaozhi Chu Zhouwei Zhang Hucheng Lei Fengjie Zheng Wei Zhang |
| author_facet | Jun Liu Shanhong Xia Chunrong Peng Zhengwei Wu Zhaozhi Chu Zhouwei Zhang Hucheng Lei Fengjie Zheng Wei Zhang |
| author_sort | Jun Liu |
| collection | DOAJ |
| description | This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used as the sensing channel to transmit the external electric field to the surface of the sensitive structure, and the vacuum packaging was realized through anodic bonding between the SOI and glass-on-silicon (GOS). The fabrication process was designed and successfully realized, featured with a simplified process and highly efficient batch manufacturing, and the final chip size was only 5 × 5 mm. A theoretical model for the packaged device was set up. The influence of key parameters in the packaging structure on the output characteristics of the microsensor was analyzed on the basis of the proposed model. Experiments were conducted on the wafer-level vacuum-packaged EFM to characterize its performance. Experimental results show that, under the condition of applying 5 V DC driving voltage, the required AC driving voltage of the sensor was only 0.05 V<sub>P</sub>, and the feedthrough was only 4.2 mV. The quality factor was higher than 5000 and was maintained with no drop in the 50-day test. The vacuum in the chamber of the sensor was about 10 Pa. A sensitivity of 0.16 mV/(kV/m) was achieved within the electrostatic field range of 0–50 kV/m. The linearity of the microsensor was 1.62%, and the uncertainty was 4.42%. |
| first_indexed | 2024-03-09T23:01:26Z |
| format | Article |
| id | doaj.art-d072267adc1a4db6b48df94caa8a1d60 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T23:01:26Z |
| publishDate | 2022-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-d072267adc1a4db6b48df94caa8a1d602023-11-23T18:01:44ZengMDPI AGMicromachines2072-666X2022-06-0113692810.3390/mi13060928Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and CharacterizationJun Liu0Shanhong Xia1Chunrong Peng2Zhengwei Wu3Zhaozhi Chu4Zhouwei Zhang5Hucheng Lei6Fengjie Zheng7Wei Zhang8State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaState Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaState Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaState Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaInstitute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaState Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaState Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaState Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaState Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, ChinaThis paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used as the sensing channel to transmit the external electric field to the surface of the sensitive structure, and the vacuum packaging was realized through anodic bonding between the SOI and glass-on-silicon (GOS). The fabrication process was designed and successfully realized, featured with a simplified process and highly efficient batch manufacturing, and the final chip size was only 5 × 5 mm. A theoretical model for the packaged device was set up. The influence of key parameters in the packaging structure on the output characteristics of the microsensor was analyzed on the basis of the proposed model. Experiments were conducted on the wafer-level vacuum-packaged EFM to characterize its performance. Experimental results show that, under the condition of applying 5 V DC driving voltage, the required AC driving voltage of the sensor was only 0.05 V<sub>P</sub>, and the feedthrough was only 4.2 mV. The quality factor was higher than 5000 and was maintained with no drop in the 50-day test. The vacuum in the chamber of the sensor was about 10 Pa. A sensitivity of 0.16 mV/(kV/m) was achieved within the electrostatic field range of 0–50 kV/m. The linearity of the microsensor was 1.62%, and the uncertainty was 4.42%.https://www.mdpi.com/2072-666X/13/6/928wafer-level vacuum packagingelectric field microsensorMEMSstructural capacitance model |
| spellingShingle | Jun Liu Shanhong Xia Chunrong Peng Zhengwei Wu Zhaozhi Chu Zhouwei Zhang Hucheng Lei Fengjie Zheng Wei Zhang Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization Micromachines wafer-level vacuum packaging electric field microsensor MEMS structural capacitance model |
| title | Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization |
| title_full | Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization |
| title_fullStr | Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization |
| title_full_unstemmed | Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization |
| title_short | Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization |
| title_sort | wafer level vacuum packaged electric field microsensor structure design theoretical model microfabrication and characterization |
| topic | wafer-level vacuum packaging electric field microsensor MEMS structural capacitance model |
| url | https://www.mdpi.com/2072-666X/13/6/928 |
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