Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization

Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization

This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used as the sensing channel to transmit the ext...

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Bibliographic Details
Main Authors: Jun Liu, Shanhong Xia, Chunrong Peng, Zhengwei Wu, Zhaozhi Chu, Zhouwei Zhang, Hucheng Lei, Fengjie Zheng, Wei Zhang
Format: Article
Language:English
Published: MDPI AG 2022-06-01
Series:Micromachines
Subjects:
wafer-level vacuum packaging
electric field microsensor
MEMS
structural capacitance model
Online Access:https://www.mdpi.com/2072-666X/13/6/928

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