Impact of Thermal Annealing on the Dissolution of Semiconducting Polymer Thin Films

Impact of Thermal Annealing on the Dissolution of Semiconducting Polymer Thin Films

Abstract Here, the effect of thermal annealing (TA) on the stability of solution‐sheared thin films of the semiconducting polymer poly[2,5‐bis(2‐octyldodecyl)pyrrolo[3,4‐c]pyrrole‐1,4(2H,5H)‐dione‐3,6‐diyl)‐alt‐(2,2′;5′,2′’;5′’,2′’’‐quaterthiophen‐5,5′’’‐diyl)] (PDPP4T) against the original coating...

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Main Authors: Shaoling Bai, Katherina Haase, Jonathan Perez Andrade, Mike Hambsch, Felix Talnack, Vojtech Millek, Anupam Prasoon, Jinxin Liu, Kerstin Arnhold, Susanne Boye, Xinliang Feng, Stefan C. B. Mannsfeld
格式: 文件
语言:English
出版: Wiley-VCH 2024-07-01
丛编:Advanced Electronic Materials
主题:
multi‐layer deposition
OFETs, polymer semiconductor
sequential solution process
thermal annealing
thermal cross‐linking
在线阅读:https://doi.org/10.1002/aelm.202300801

因特网

https://doi.org/10.1002/aelm.202300801

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