Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing
When a diamond grinding wheel is used to create the cutting edge of a carbide tool, it induces latent flaws in the tool material. We developed a fixed abrasive wheel for solid phase chemical–mechanical polishing (SPCMP) and successfully sharpened the cutting edge of cemented carbide (WC–Co) tools wh...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422011164 |
| _version_ | 1811199934933762048 |
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| author | Yayoi Tanaka Hisashi Sato Osamu Eryu |
| author_facet | Yayoi Tanaka Hisashi Sato Osamu Eryu |
| author_sort | Yayoi Tanaka |
| collection | DOAJ |
| description | When a diamond grinding wheel is used to create the cutting edge of a carbide tool, it induces latent flaws in the tool material. We developed a fixed abrasive wheel for solid phase chemical–mechanical polishing (SPCMP) and successfully sharpened the cutting edge of cemented carbide (WC–Co) tools while removing the latent flaws on the cutting edge. X-ray diffraction and electron backscattering diffraction measurements revealed that the SPCMP method removes latent scratches from the surfaces of WC–Co materials. Further, it can remove latent scratches introduced by the diamond wheel on the cutting edge of WC–Co tools, thus reducing the wear rate and extending their service life, as verified by conducting cutting experiments on Ti–6Al–4V and Inconel 718. Thin-film X-ray diffraction measurements using synchrotron light revealed that the processing strain on the surfaces of Ti–6Al–4V and Inconel 718 machined by the WC–Co cutting tool with SPCMP processing was extremely small when compared with the processing strain in the case without SPCMP processing. |
| first_indexed | 2024-04-12T01:56:19Z |
| format | Article |
| id | doaj.art-d2963ae4137c4211a7b5ac80eafda927 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-04-12T01:56:19Z |
| publishDate | 2022-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-d2963ae4137c4211a7b5ac80eafda9272022-12-22T03:52:48ZengElsevierJournal of Materials Research and Technology2238-78542022-09-0120606615Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishingYayoi Tanaka0Hisashi Sato1Osamu Eryu2Corresponding author.; Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya, Aichi 466-8555, JapanNagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya, Aichi 466-8555, JapanNagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya, Aichi 466-8555, JapanWhen a diamond grinding wheel is used to create the cutting edge of a carbide tool, it induces latent flaws in the tool material. We developed a fixed abrasive wheel for solid phase chemical–mechanical polishing (SPCMP) and successfully sharpened the cutting edge of cemented carbide (WC–Co) tools while removing the latent flaws on the cutting edge. X-ray diffraction and electron backscattering diffraction measurements revealed that the SPCMP method removes latent scratches from the surfaces of WC–Co materials. Further, it can remove latent scratches introduced by the diamond wheel on the cutting edge of WC–Co tools, thus reducing the wear rate and extending their service life, as verified by conducting cutting experiments on Ti–6Al–4V and Inconel 718. Thin-film X-ray diffraction measurements using synchrotron light revealed that the processing strain on the surfaces of Ti–6Al–4V and Inconel 718 machined by the WC–Co cutting tool with SPCMP processing was extremely small when compared with the processing strain in the case without SPCMP processing.http://www.sciencedirect.com/science/article/pii/S2238785422011164Chemical–mechanical polishingCemented carbide toolGrinding wheelX-ray diffractionElectron backscattering diffraction |
| spellingShingle | Yayoi Tanaka Hisashi Sato Osamu Eryu Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing Journal of Materials Research and Technology Chemical–mechanical polishing Cemented carbide tool Grinding wheel X-ray diffraction Electron backscattering diffraction |
| title | Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing |
| title_full | Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing |
| title_fullStr | Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing |
| title_full_unstemmed | Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing |
| title_short | Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing |
| title_sort | improved cemented carbide tool edge formed by solid phase chemical mechanical polishing |
| topic | Chemical–mechanical polishing Cemented carbide tool Grinding wheel X-ray diffraction Electron backscattering diffraction |
| url | http://www.sciencedirect.com/science/article/pii/S2238785422011164 |
| work_keys_str_mv | AT yayoitanaka improvedcementedcarbidetooledgeformedbysolidphasechemicalmechanicalpolishing AT hisashisato improvedcementedcarbidetooledgeformedbysolidphasechemicalmechanicalpolishing AT osamueryu improvedcementedcarbidetooledgeformedbysolidphasechemicalmechanicalpolishing |