Evolución microestructural de capas delgadas de cobre por flujo de corriente eléctrica aplicada
The microstructural evolution during electrical current flow application on copper thin films was studied. The morphological analysis by atomic force microscopy (AFM), and the structural analysis by grazing incidence X-ray diffraction (XRD) were realized when an electrical current between 0 and 2.2A...
| Váldodahkkit: | , , , , |
|---|---|
| Materiálatiipa: | Artihkal |
| Giella: | English |
| Almmustuhtton: |
Elsevier
2004-08-01
|
| Ráidu: | Boletín de la Sociedad Española de Cerámica y Vidrio |
| Fáttát: | |
| Liŋkkat: | http://ceramicayvidrio.revistas.csic.es/index.php/ceramicayvidrio/article/view/438/457 |