Evolución microestructural de capas delgadas de cobre por flujo de corriente eléctrica aplicada
The microstructural evolution during electrical current flow application on copper thin films was studied. The morphological analysis by atomic force microscopy (AFM), and the structural analysis by grazing incidence X-ray diffraction (XRD) were realized when an electrical current between 0 and 2.2A...
| Những tác giả chính: | , , , , |
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| Định dạng: | Bài viết |
| Ngôn ngữ: | English |
| Được phát hành: |
Elsevier
2004-08-01
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| Loạt: | Boletín de la Sociedad Española de Cerámica y Vidrio |
| Những chủ đề: | |
| Truy cập trực tuyến: | http://ceramicayvidrio.revistas.csic.es/index.php/ceramicayvidrio/article/view/438/457 |