The frictional energy dissipation and interfacial heat conduction in the sliding interface
The energy dissipation rate and interfacial thermal conductance between two sliding surfaces are important to accurately predict the interface temperature rise, while their physical mechanism is not well understood. In this study the energy dissipation and interfacial thermal transport between a sli...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2018-11-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.5054876 |
| _version_ | 1811287907000909824 |
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| author | Zhiyong Wei Yajing Kan Yan Zhang Yunfei Chen |
| author_facet | Zhiyong Wei Yajing Kan Yan Zhang Yunfei Chen |
| author_sort | Zhiyong Wei |
| collection | DOAJ |
| description | The energy dissipation rate and interfacial thermal conductance between two sliding surfaces are important to accurately predict the interface temperature rise, while their physical mechanism is not well understood. In this study the energy dissipation and interfacial thermal transport between a sliding silicon film and a fixed silicon substrate are investigated by molecular dynamics simulations. The results show that the mean friction force first increases with increasing normal load. However, when the normal load exceeds the critical value of about 60 eV/Å, the interface atoms begin to collapse, causing the mean friction force to drop with the further increase of the normal load. Our study also shows that the energy dissipated during the friction process is quantitatively equal to the conducted heat. By extracting the interfacial temperature difference, it is found that the interfacial thermal conductance in sliding state is 2∼4 times higher than that in static state with the same normal load from 10 to 60 eV/Å. This is because the interfacial atoms suffer great dynamic impacts during the friction process, which excites more non-equilibrium phonons and helps to enhance the phonon interfacial transmission coefficient. The present investigation demonstrates that the dynamic excitation induced by the friction process can modify the interfacial thermal conductance, which would be of great significance to accurately predict the temperature rise of the sliding interface. |
| first_indexed | 2024-04-13T03:26:44Z |
| format | Article |
| id | doaj.art-d34c09afca7c42c7bd603936447ad757 |
| institution | Directory Open Access Journal |
| issn | 2158-3226 |
| language | English |
| last_indexed | 2024-04-13T03:26:44Z |
| publishDate | 2018-11-01 |
| publisher | AIP Publishing LLC |
| record_format | Article |
| series | AIP Advances |
| spelling | doaj.art-d34c09afca7c42c7bd603936447ad7572022-12-22T03:04:38ZengAIP Publishing LLCAIP Advances2158-32262018-11-01811115321115321-1110.1063/1.5054876079811ADVThe frictional energy dissipation and interfacial heat conduction in the sliding interfaceZhiyong Wei0Yajing Kan1Yan Zhang2Yunfei Chen3Jiangsu Key Laboratory for Design & Manufacture of Micro/Nano Biomedical Instruments and Department of Mechanical Engineering, Southeast University, Nanjing 210096, People’s Republic of ChinaJiangsu Key Laboratory for Design & Manufacture of Micro/Nano Biomedical Instruments and Department of Mechanical Engineering, Southeast University, Nanjing 210096, People’s Republic of ChinaJiangsu Key Laboratory for Design & Manufacture of Micro/Nano Biomedical Instruments and Department of Mechanical Engineering, Southeast University, Nanjing 210096, People’s Republic of ChinaJiangsu Key Laboratory for Design & Manufacture of Micro/Nano Biomedical Instruments and Department of Mechanical Engineering, Southeast University, Nanjing 210096, People’s Republic of ChinaThe energy dissipation rate and interfacial thermal conductance between two sliding surfaces are important to accurately predict the interface temperature rise, while their physical mechanism is not well understood. In this study the energy dissipation and interfacial thermal transport between a sliding silicon film and a fixed silicon substrate are investigated by molecular dynamics simulations. The results show that the mean friction force first increases with increasing normal load. However, when the normal load exceeds the critical value of about 60 eV/Å, the interface atoms begin to collapse, causing the mean friction force to drop with the further increase of the normal load. Our study also shows that the energy dissipated during the friction process is quantitatively equal to the conducted heat. By extracting the interfacial temperature difference, it is found that the interfacial thermal conductance in sliding state is 2∼4 times higher than that in static state with the same normal load from 10 to 60 eV/Å. This is because the interfacial atoms suffer great dynamic impacts during the friction process, which excites more non-equilibrium phonons and helps to enhance the phonon interfacial transmission coefficient. The present investigation demonstrates that the dynamic excitation induced by the friction process can modify the interfacial thermal conductance, which would be of great significance to accurately predict the temperature rise of the sliding interface.http://dx.doi.org/10.1063/1.5054876 |
| spellingShingle | Zhiyong Wei Yajing Kan Yan Zhang Yunfei Chen The frictional energy dissipation and interfacial heat conduction in the sliding interface AIP Advances |
| title | The frictional energy dissipation and interfacial heat conduction in the sliding interface |
| title_full | The frictional energy dissipation and interfacial heat conduction in the sliding interface |
| title_fullStr | The frictional energy dissipation and interfacial heat conduction in the sliding interface |
| title_full_unstemmed | The frictional energy dissipation and interfacial heat conduction in the sliding interface |
| title_short | The frictional energy dissipation and interfacial heat conduction in the sliding interface |
| title_sort | frictional energy dissipation and interfacial heat conduction in the sliding interface |
| url | http://dx.doi.org/10.1063/1.5054876 |
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