Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material

Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material

As feature density increases within microelectronics, so does the dissipated power density, which puts an increased demand on thermal management. Thermal interface materials (TIMs) are used at the interface between contacting surfaces to reduce the thermal resistance, and is a critical component wit...

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Bibliographic Details
Main Authors: Andreas Nylander, Josef Hansson, Majid Kabiri Samani, Christian Chandra Darmawan, Ana Borta Boyon, Laurent Divay, Lilei Ye, Yifeng Fu, Afshin Ziaei, Johan Liu
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Energies
Subjects:
thermal management
carbon nanotubes
thermal interface material
reliability
thermal aging
Online Access:https://www.mdpi.com/1996-1073/12/11/2080

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https://www.mdpi.com/1996-1073/12/11/2080

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