Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> Microparticle
One important challenge that faces the metallurgic industry turns around the constant increment in the mechanical resistance of certain finished products. Metallurgic advantages can be obtained from the inclusion of microparticles in metallic materials, but this inclusion involves complex challenges...
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| Format: | Article |
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MDPI AG
2020-12-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/14/1/134 |
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| author | Pedro Alejandro Tamayo-Meza Miguel Ángel Cerro-Ramírez Emmanuel Alejandro Merchán-Cruz Usiel Sandino Silva-Rivera Raúl Rivera-Blas Luis Armando Flores-Herrera |
| author_facet | Pedro Alejandro Tamayo-Meza Miguel Ángel Cerro-Ramírez Emmanuel Alejandro Merchán-Cruz Usiel Sandino Silva-Rivera Raúl Rivera-Blas Luis Armando Flores-Herrera |
| author_sort | Pedro Alejandro Tamayo-Meza |
| collection | DOAJ |
| description | One important challenge that faces the metallurgic industry turns around the constant increment in the mechanical resistance of certain finished products. Metallurgic advantages can be obtained from the inclusion of microparticles in metallic materials, but this inclusion involves complex challenges as the internal stress distribution can be modified. In this work, the simulation of a cooling sequence in 7075 aluminum with a SiO<sub>2</sub> microparticle is presented. Two models of two-dimensional (2D) type were constructed in ANSYS<sup>®</sup>2019 with circular and oval shape microparticles located inside the aluminum. Both models were subjected to the same thermomechanical transient analysis to compare the remaining stress distributions around the microparticles after the thermal load and to observe the effect of the geometrical shape. The results show remaining stresses increased in the oval model as a consequence of the geometrical shape modification. After applying a tension load in the analyzed specimens, shear stress concentrations were observed with a higher magnitude around the covertex of the oval shape. The results can be very useful for the creation of materials with controlled remnant stress located in specific or desired locations in the matrix. |
| first_indexed | 2024-03-10T13:40:06Z |
| format | Article |
| id | doaj.art-d41245ce4b344fb9bd42ad1b7b513897 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-10T13:40:06Z |
| publishDate | 2020-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-d41245ce4b344fb9bd42ad1b7b5138972023-11-21T03:10:44ZengMDPI AGMaterials1996-19442020-12-0114113410.3390/ma14010134Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> MicroparticlePedro Alejandro Tamayo-Meza0Miguel Ángel Cerro-Ramírez1Emmanuel Alejandro Merchán-Cruz2Usiel Sandino Silva-Rivera3Raúl Rivera-Blas4Luis Armando Flores-Herrera5Postgraduate Studies and Research Section, Instituto Politecnico Nacional, Higher School of Mechanical and Electrical Engineering, U. Azcapotzalco, Av. Granjas 682, Mexico City 02250, MexicoMechatronics Engineering Department, Tecnológico de Estudios Superiores de Coacalco, Av. 16 de Septiembre 54, Coacalco de Berriozábal 55700, Edo. de Mex., MexicoPostgraduate Studies and Research Section, Instituto Politecnico Nacional, Higher School of Mechanical and Electrical Engineering, U. Azcapotzalco, Av. Granjas 682, Mexico City 02250, MexicoSEDENA, D.G.E.M., Escuela Militar de Ingenieros, Secc. of Industrial Engineering, Army and Air Force University, Escuela Militar de Ingenieros, Av. Industria Militar 261, Naucalpan de Juarez 53960, Edo. de Mex., MexicoPostgraduate Studies and Research Section, Instituto Politecnico Nacional, Higher School of Mechanical and Electrical Engineering, U. Azcapotzalco, Av. Granjas 682, Mexico City 02250, MexicoPostgraduate Studies and Research Section, Instituto Politecnico Nacional, Higher School of Mechanical and Electrical Engineering, U. Azcapotzalco, Av. Granjas 682, Mexico City 02250, MexicoOne important challenge that faces the metallurgic industry turns around the constant increment in the mechanical resistance of certain finished products. Metallurgic advantages can be obtained from the inclusion of microparticles in metallic materials, but this inclusion involves complex challenges as the internal stress distribution can be modified. In this work, the simulation of a cooling sequence in 7075 aluminum with a SiO<sub>2</sub> microparticle is presented. Two models of two-dimensional (2D) type were constructed in ANSYS<sup>®</sup>2019 with circular and oval shape microparticles located inside the aluminum. Both models were subjected to the same thermomechanical transient analysis to compare the remaining stress distributions around the microparticles after the thermal load and to observe the effect of the geometrical shape. The results show remaining stresses increased in the oval model as a consequence of the geometrical shape modification. After applying a tension load in the analyzed specimens, shear stress concentrations were observed with a higher magnitude around the covertex of the oval shape. The results can be very useful for the creation of materials with controlled remnant stress located in specific or desired locations in the matrix.https://www.mdpi.com/1996-1944/14/1/134microparticlestress stateplate defectssimultaneous cooling |
| spellingShingle | Pedro Alejandro Tamayo-Meza Miguel Ángel Cerro-Ramírez Emmanuel Alejandro Merchán-Cruz Usiel Sandino Silva-Rivera Raúl Rivera-Blas Luis Armando Flores-Herrera Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> Microparticle Materials microparticle stress state plate defects simultaneous cooling |
| title | Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> Microparticle |
| title_full | Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> Microparticle |
| title_fullStr | Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> Microparticle |
| title_full_unstemmed | Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> Microparticle |
| title_short | Transient Thermomechanical Simulation of 7075 Aluminum Contraction around a SiO<sub>2</sub> Microparticle |
| title_sort | transient thermomechanical simulation of 7075 aluminum contraction around a sio sub 2 sub microparticle |
| topic | microparticle stress state plate defects simultaneous cooling |
| url | https://www.mdpi.com/1996-1944/14/1/134 |
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