Optimization of Copper Electroforming Process Parameters Based on Double Hidden Layer BP Neural Network

Optimization of Copper Electroforming Process Parameters Based on Double Hidden Layer BP Neural Network

In order to optimize the pulse electroforming copper process, a double hidden layer BP (back propagation) neural network was constructed. Through sample training, the mapping relationship between electroforming copper process conditions and target properties was accurately established, and the predi...

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Bibliographic Details
Main Authors: Feng Ji, Chao Chen, Yongfei Zhao, Byungwon Min
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Micromachines
Subjects:
double hidden layer
BP neural network
electroforming
optimization
Online Access:https://www.mdpi.com/2072-666X/12/10/1157

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