Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid Solutions

Abstract Bismuth‐telluride‐based solid solutions are the best commercial thermoelectric materials near room temperature. For their n‐type polycrystalline compounds, the maximum figures of merit (zTs) are often less than 1.0 due to the degraded carrier mobility resulting from the loss of texture. Her...

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Main Authors: Yehao Wu, Yuan Yu, Qi Zhang, Tiejun Zhu, Renshuang Zhai, Xinbing Zhao
Format: Article
Language:English
Published: Wiley 2019-11-01
Series:Advanced Science
Subjects:
Online Access:https://doi.org/10.1002/advs.201901702
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author Yehao Wu
Yuan Yu
Qi Zhang
Tiejun Zhu
Renshuang Zhai
Xinbing Zhao
author_facet Yehao Wu
Yuan Yu
Qi Zhang
Tiejun Zhu
Renshuang Zhai
Xinbing Zhao
author_sort Yehao Wu
collection DOAJ
description Abstract Bismuth‐telluride‐based solid solutions are the best commercial thermoelectric materials near room temperature. For their n‐type polycrystalline compounds, the maximum figures of merit (zTs) are often less than 1.0 due to the degraded carrier mobility resulting from the loss of texture. Herein, a liquid‐phase hot deformation procedure, during which the Bi2(Te,Se)3 ingots are directly hot deformed with the extrusion of liquid eutectic phase, is performed to enhance the thermoelectric performance of n‐type Bi2(Te,Se)3 alloys. The deformation‐induced dynamic recrystallization is remarkably suppressed due to the reduction of nucleation sites and the release of deformation stress by liquid phase, contributing to a weakened carrier scattering and enhanced carrier mobility. The liquid eutectic phase also facilitates the rotation of grains and enhanced (000l) texture, further improving carrier mobility. In addition, the dense dislocations and lattice distortion introduced into the matrix reduce the lattice thermal conductivity. As a result, a high zT value of 1.1 at 400 K is obtained, about 75% increment over the normal one‐step hot deformed alloys. This work not only demonstrates a simple and efficient technique for achieving superior n‐type Bi2Te3‐based materials, but also elucidates the important role of liquid eutectic phase in hot deformation.
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spelling doaj.art-d4c879f8f58d48fe87184bb782db45532022-12-21T19:15:50ZengWileyAdvanced Science2198-38442019-11-01621n/an/a10.1002/advs.201901702Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid SolutionsYehao Wu0Yuan Yu1Qi Zhang2Tiejun Zhu3Renshuang Zhai4Xinbing Zhao5State Key Laboratory of Silicon Materials and School of Materials Science and Engineering Zhejiang University Hangzhou 310027 ChinaI. Physikalisches Institut (IA) RWTH Aachen University 52074 Aachen GermanyState Key Laboratory of Silicon Materials and School of Materials Science and Engineering Zhejiang University Hangzhou 310027 ChinaState Key Laboratory of Silicon Materials and School of Materials Science and Engineering Zhejiang University Hangzhou 310027 ChinaState Key Laboratory of Silicon Materials and School of Materials Science and Engineering Zhejiang University Hangzhou 310027 ChinaState Key Laboratory of Silicon Materials and School of Materials Science and Engineering Zhejiang University Hangzhou 310027 ChinaAbstract Bismuth‐telluride‐based solid solutions are the best commercial thermoelectric materials near room temperature. For their n‐type polycrystalline compounds, the maximum figures of merit (zTs) are often less than 1.0 due to the degraded carrier mobility resulting from the loss of texture. Herein, a liquid‐phase hot deformation procedure, during which the Bi2(Te,Se)3 ingots are directly hot deformed with the extrusion of liquid eutectic phase, is performed to enhance the thermoelectric performance of n‐type Bi2(Te,Se)3 alloys. The deformation‐induced dynamic recrystallization is remarkably suppressed due to the reduction of nucleation sites and the release of deformation stress by liquid phase, contributing to a weakened carrier scattering and enhanced carrier mobility. The liquid eutectic phase also facilitates the rotation of grains and enhanced (000l) texture, further improving carrier mobility. In addition, the dense dislocations and lattice distortion introduced into the matrix reduce the lattice thermal conductivity. As a result, a high zT value of 1.1 at 400 K is obtained, about 75% increment over the normal one‐step hot deformed alloys. This work not only demonstrates a simple and efficient technique for achieving superior n‐type Bi2Te3‐based materials, but also elucidates the important role of liquid eutectic phase in hot deformation.https://doi.org/10.1002/advs.201901702bismuth tellurideshot deformationthermoelectric materialsthermoelectric properties
spellingShingle Yehao Wu
Yuan Yu
Qi Zhang
Tiejun Zhu
Renshuang Zhai
Xinbing Zhao
Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid Solutions
Advanced Science
bismuth tellurides
hot deformation
thermoelectric materials
thermoelectric properties
title Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid Solutions
title_full Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid Solutions
title_fullStr Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid Solutions
title_full_unstemmed Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid Solutions
title_short Liquid‐Phase Hot Deformation to Enhance Thermoelectric Performance of n‐type Bismuth‐Telluride‐Based Solid Solutions
title_sort liquid phase hot deformation to enhance thermoelectric performance of n type bismuth telluride based solid solutions
topic bismuth tellurides
hot deformation
thermoelectric materials
thermoelectric properties
url https://doi.org/10.1002/advs.201901702
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