Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range

The diamond-like carbon (DLC) is important for passivation of junction termination in high power devices due to its excellent electrical, mechanical, and thermal properties. While the role of conductivity and polarization of the DLC layer on the blocking capability of a p-n junction has been explain...

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Main Authors: L. Balestra, S. Reggiani, A. Gnudi, E. Gnani, J. Dobrzynska, J. Vobecky
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9404302/
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author L. Balestra
S. Reggiani
A. Gnudi
E. Gnani
J. Dobrzynska
J. Vobecky
author_facet L. Balestra
S. Reggiani
A. Gnudi
E. Gnani
J. Dobrzynska
J. Vobecky
author_sort L. Balestra
collection DOAJ
description The diamond-like carbon (DLC) is important for passivation of junction termination in high power devices due to its excellent electrical, mechanical, and thermal properties. While the role of conductivity and polarization of the DLC layer on the blocking capability of a p-n junction has been explained recently, the thermal behavior still needs to be addressed. For this purpose, the diode leakage current was measured on large area power diodes with negative bevel coated by the DLC in a typical industrial range between 300 and 413 K. An unusual deviation from the expected Arrhenius law was experimentally observed. A predictive TCAD model, which incorporates the effect of the DLC layer, has been developed to study the impact of the DLC layer parameters on diode thermal performance. Both the electrostatic features and charge transport mechanisms through and along the DLC/Silicon interface have been modeled over a wide range of temperatures. Different DLC/Silicon doping combinations have been analyzed to explain the main effects determining the temperature dependence of diode leakage current and breakdown voltage. A complete validation of the TCAD approach has been achieved.
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spelling doaj.art-d55c214f3db0445a9ef9346f0e48bf052022-12-22T00:00:59ZengIEEEIEEE Journal of the Electron Devices Society2168-67342021-01-01943144010.1109/JEDS.2021.30732329404302Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature RangeL. Balestra0https://orcid.org/0000-0002-0598-899XS. Reggiani1https://orcid.org/0000-0002-9616-8558A. Gnudi2https://orcid.org/0000-0002-2186-3468E. Gnani3https://orcid.org/0000-0001-6949-5919J. Dobrzynska4J. Vobecky5https://orcid.org/0000-0002-2078-2244ARCES Research Center, University of Bologna, Bologna, ItalyARCES Research Center, University of Bologna, Bologna, ItalyARCES Research Center, University of Bologna, Bologna, ItalyARCES Research Center, University of Bologna, Bologna, ItalyHitachi ABB Power Grids, Lenzburg, SwitzerlandHitachi ABB Power Grids, Lenzburg, SwitzerlandThe diamond-like carbon (DLC) is important for passivation of junction termination in high power devices due to its excellent electrical, mechanical, and thermal properties. While the role of conductivity and polarization of the DLC layer on the blocking capability of a p-n junction has been explained recently, the thermal behavior still needs to be addressed. For this purpose, the diode leakage current was measured on large area power diodes with negative bevel coated by the DLC in a typical industrial range between 300 and 413 K. An unusual deviation from the expected Arrhenius law was experimentally observed. A predictive TCAD model, which incorporates the effect of the DLC layer, has been developed to study the impact of the DLC layer parameters on diode thermal performance. Both the electrostatic features and charge transport mechanisms through and along the DLC/Silicon interface have been modeled over a wide range of temperatures. Different DLC/Silicon doping combinations have been analyzed to explain the main effects determining the temperature dependence of diode leakage current and breakdown voltage. A complete validation of the TCAD approach has been achieved.https://ieeexplore.ieee.org/document/9404302/Diamond-like carbon (DLC)junction termination (JT)negative bevelpower semiconductor devicesTCAD modeling
spellingShingle L. Balestra
S. Reggiani
A. Gnudi
E. Gnani
J. Dobrzynska
J. Vobecky
Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range
IEEE Journal of the Electron Devices Society
Diamond-like carbon (DLC)
junction termination (JT)
negative bevel
power semiconductor devices
TCAD modeling
title Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range
title_full Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range
title_fullStr Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range
title_full_unstemmed Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range
title_short Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range
title_sort influence of the dlc passivation conductivity on the performance of silicon high power diodes over an extended temperature range
topic Diamond-like carbon (DLC)
junction termination (JT)
negative bevel
power semiconductor devices
TCAD modeling
url https://ieeexplore.ieee.org/document/9404302/
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