Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

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In this study, the combined effect of GNSs (graphene nanosheets) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of intermetallic compounds (IMCs) and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder system was studied. Both plain and composite solder systems (SAC...

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Bibliographic Details
Main Authors: K. Vidyatharran, M.A. Azmah Hanim, T.T. Dele-Afolabi, K.A. Matori, O. Saliza Azlina
Format: Article
Language:English
Published: Elsevier 2021-11-01
Series:Journal of Materials Research and Technology
Subjects:
Lead-free solders
Graphene nanosheets
ENIAg surface finish
Intermetallic compounds
Shear strength
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785421010486

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