Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks
Artificial limbs, equipped with miniaturized tactile sensors, can handle objects with more dexterousness. Next to detecting forces, the sensor devices are also able to measure temperature. With this additional information, the touched objects can be better characterized. As such sensors, active CMOS...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2018-09-01
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| Series: | Current Directions in Biomedical Engineering |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/cdbme-2018-0143 |
| _version_ | 1797740410937802752 |
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| author | Fischer Roland Ditler Heinrich Görtz Michael Mokwa Wilfried |
| author_facet | Fischer Roland Ditler Heinrich Görtz Michael Mokwa Wilfried |
| author_sort | Fischer Roland |
| collection | DOAJ |
| description | Artificial limbs, equipped with miniaturized tactile sensors, can handle objects with more dexterousness. Next to detecting forces, the sensor devices are also able to measure temperature. With this additional information, the touched objects can be better characterized. As such sensors, active CMOS-based capacitive pressure sensors are used in this work. The Sensors are thinned to 20-30 μm target thickness to make them bendable. One challenge of such thin sensors is the strong dependence of the output signal upon bending. To compensate this dependency, two sensors were mounted back to back. This allows a numerical adjustment of the two characteristic sensor output signals to mechanical stress curves. After electrically contacting of the stacks with a 15 μm thin polyimide foil substrate, the bending dependence of the stacks was characterized with a four-point bending procedure. By this characterization the dependency of the pressure sensor output signal on the height of mechanical stress was determined. Both sensor output signals show an inverted behavior under the same mechanical stress which confirmed prior simulation results with the same setup. Based on this information, a numerical method for compensating the bending dependence was successfully proven. |
| first_indexed | 2024-03-12T14:12:03Z |
| format | Article |
| id | doaj.art-d6392c4601d94680b4da9c85afc2b71b |
| institution | Directory Open Access Journal |
| issn | 2364-5504 |
| language | English |
| last_indexed | 2024-03-12T14:12:03Z |
| publishDate | 2018-09-01 |
| publisher | De Gruyter |
| record_format | Article |
| series | Current Directions in Biomedical Engineering |
| spelling | doaj.art-d6392c4601d94680b4da9c85afc2b71b2023-08-21T06:42:02ZengDe GruyterCurrent Directions in Biomedical Engineering2364-55042018-09-014159559810.1515/cdbme-2018-0143cdbme-2018-0143Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor StacksFischer Roland0Ditler Heinrich1Görtz Michael2Mokwa Wilfried3RWTH Aachen University, Institute of Materials in Electrical Engineering 1, Sommerfeldstr. 24,Aachen, GermanyRWTH Aachen University, Institute of Materials in Electrical Engineering 1,Aachen, GermanyFraunhofer IMS,Duisburg, GermanyRWTH Aachen University, Institute of Materials in Electrical Engineering 1,Aachen, GermanyArtificial limbs, equipped with miniaturized tactile sensors, can handle objects with more dexterousness. Next to detecting forces, the sensor devices are also able to measure temperature. With this additional information, the touched objects can be better characterized. As such sensors, active CMOS-based capacitive pressure sensors are used in this work. The Sensors are thinned to 20-30 μm target thickness to make them bendable. One challenge of such thin sensors is the strong dependence of the output signal upon bending. To compensate this dependency, two sensors were mounted back to back. This allows a numerical adjustment of the two characteristic sensor output signals to mechanical stress curves. After electrically contacting of the stacks with a 15 μm thin polyimide foil substrate, the bending dependence of the stacks was characterized with a four-point bending procedure. By this characterization the dependency of the pressure sensor output signal on the height of mechanical stress was determined. Both sensor output signals show an inverted behavior under the same mechanical stress which confirmed prior simulation results with the same setup. Based on this information, a numerical method for compensating the bending dependence was successfully proven.https://doi.org/10.1515/cdbme-2018-0143smart skinflexible electronicscmos pressure sensorfour-point bending testdicing by thinning |
| spellingShingle | Fischer Roland Ditler Heinrich Görtz Michael Mokwa Wilfried Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks Current Directions in Biomedical Engineering smart skin flexible electronics cmos pressure sensor four-point bending test dicing by thinning |
| title | Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks |
| title_full | Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks |
| title_fullStr | Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks |
| title_full_unstemmed | Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks |
| title_short | Fabrication and Characterization of Bending- Independent Capacitive CMOS Pressure Sensor Stacks |
| title_sort | fabrication and characterization of bending independent capacitive cmos pressure sensor stacks |
| topic | smart skin flexible electronics cmos pressure sensor four-point bending test dicing by thinning |
| url | https://doi.org/10.1515/cdbme-2018-0143 |
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