Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) Applicationss

Microelectromechanical Systems (MEMS) devices suffer from reliability problems which affect its performance. Fabrication process initiate residual stresses that cause stress stiffening and curling. It is shown from the previous research that reducing both stiffening and curling is a challenging issu...

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Main Authors: Bahi Bakeer, Adel Elsabbagh, Mohammed Hedaya
Format: Article
Language:English
Published: Port Said University 2021-09-01
Series:Port Said Engineering Research Journal
Subjects:
Online Access:https://pserj.journals.ekb.eg/article_147396_0e15d56c710c5f00b3c555303e4233eb.pdf
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author Bahi Bakeer
Adel Elsabbagh
Mohammed Hedaya
author_facet Bahi Bakeer
Adel Elsabbagh
Mohammed Hedaya
author_sort Bahi Bakeer
collection DOAJ
description Microelectromechanical Systems (MEMS) devices suffer from reliability problems which affect its performance. Fabrication process initiate residual stresses that cause stress stiffening and curling. It is shown from the previous research that reducing both stiffening and curling is a challenging issue. Analytical analysis for a fixed-fixed beam is done to determine the factors affecting stiffening in rectangular cross-section beams. A new U-shaped cross-section plate is proposed to decrease both stiffening and curling. The new U-shaped plate is compared with a reference flat plate with the same bending stiffness, length, width and material properties. In order to capture plate effects and biaxial residual stress, Finite Element model is developed. Results showed better performance of the U-shaped plate than the flat one. Curling and stiffening reduced by 72 and 42 %, respectively. Stiffness variation with temperature reduced by 43%, stabilizing the operational performance parameters such as pull-in voltage. Moreover, the critical buckling temperature of the U-shaped plate is greater than that of the flat one by 27 ℃, extending the operational temperature range of the plate. The fundamental natural frequency increased by 33%, due to the lower mass of the U-shaped plate. In general, high switching time is considered as another reliability problem in MEMS devices. The increase in fundamental natural frequency for U-shaped plate expects to reduce the switching time. The concept of U-shape plate can be used in many MEMS applications such as resonators, Radio-frequency (RF) switches, pressure sensors, and micromirrors in order to improve the reliability of these devices.
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spelling doaj.art-d820185a360d426f829dc6e52aabc7ec2023-10-23T05:57:50ZengPort Said UniversityPort Said Engineering Research Journal1110-66032536-93772021-09-0125216516910.21608/pserj.2021.54511.1084147396Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) ApplicationssBahi Bakeer0Adel Elsabbagh1Mohammed Hedaya2Design and Production Engineering Department, Faculty of Engineering, Ain Shams University University., Cairo, EgyptDesign and Production Engineering Department, Faculty of Engineering, Ain Shams University, Cairo, EgyptDesign and Production Engineering Department, Faculty of Engineering, Ain Shams University, Cairo, EgyptMicroelectromechanical Systems (MEMS) devices suffer from reliability problems which affect its performance. Fabrication process initiate residual stresses that cause stress stiffening and curling. It is shown from the previous research that reducing both stiffening and curling is a challenging issue. Analytical analysis for a fixed-fixed beam is done to determine the factors affecting stiffening in rectangular cross-section beams. A new U-shaped cross-section plate is proposed to decrease both stiffening and curling. The new U-shaped plate is compared with a reference flat plate with the same bending stiffness, length, width and material properties. In order to capture plate effects and biaxial residual stress, Finite Element model is developed. Results showed better performance of the U-shaped plate than the flat one. Curling and stiffening reduced by 72 and 42 %, respectively. Stiffness variation with temperature reduced by 43%, stabilizing the operational performance parameters such as pull-in voltage. Moreover, the critical buckling temperature of the U-shaped plate is greater than that of the flat one by 27 ℃, extending the operational temperature range of the plate. The fundamental natural frequency increased by 33%, due to the lower mass of the U-shaped plate. In general, high switching time is considered as another reliability problem in MEMS devices. The increase in fundamental natural frequency for U-shaped plate expects to reduce the switching time. The concept of U-shape plate can be used in many MEMS applications such as resonators, Radio-frequency (RF) switches, pressure sensors, and micromirrors in order to improve the reliability of these devices.https://pserj.journals.ekb.eg/article_147396_0e15d56c710c5f00b3c555303e4233eb.pdfcurlingmicroelectromechanical systems (mems)stiffeningstress gradient
spellingShingle Bahi Bakeer
Adel Elsabbagh
Mohammed Hedaya
Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) Applicationss
Port Said Engineering Research Journal
curling
microelectromechanical systems (mems)
stiffening
stress gradient
title Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) Applicationss
title_full Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) Applicationss
title_fullStr Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) Applicationss
title_full_unstemmed Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) Applicationss
title_short Design of Micro-Plates Subjected to Residual Stresses in Microelectromechanical Systems (MEMS) Applicationss
title_sort design of micro plates subjected to residual stresses in microelectromechanical systems mems applicationss
topic curling
microelectromechanical systems (mems)
stiffening
stress gradient
url https://pserj.journals.ekb.eg/article_147396_0e15d56c710c5f00b3c555303e4233eb.pdf
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