| Summary: | Controlling the evaporation process of a droplet is of the utmost importance for a number of technologies. Also, along with the advances of microfabrication, micropatterned surfaces have emerged as an important technology platform to tune the wettability and other surface properties of various fundamental and applied applications. Among the geometrical parameters of these micropatterns, it is of great interest to investigate whether the arrangement of the patterns would affect the evaporation process of a sessile liquid droplet. To address this question, we fabricated four microhole arrays with different arrangements, quantified by the parameter of “eccentricity”. The results suggested that, compared to smooth substrates, the evaporation mode was not only affected by engineering the microhole arrays, but also by the eccentricity of these micropatterns. The values of contact angle hysteresis (CAH) were used to quantify and test this hypothesis. The CAH could partially explain the different evaporation modes observed on the microhole arrays with zero and non-zero values of eccentricity. That is, on microhole arrays with zero eccentricity, CAH of water droplets was comparatively low (less than 20<inline-formula> <math display="inline"> <semantics> <mo>°</mo> </semantics> </math> </inline-formula>). Consistently, during the evaporation, around 60% of the life span of the droplet was in the mixed evaporation mode. Increasing the eccentricity of the microhole arrays increases the values of CAH to above 20<inline-formula> <math display="inline"> <semantics> <mo>°</mo> </semantics> </math> </inline-formula>. Unlike the increasing trend of CAH, the evaporation modes of sessile droplets on the microhole array with non-zero values of eccentricity were almost similar. Over 75% of the life span of droplets on these surfaces was in constant contact line (CCL) mode. Our findings play a significant role in any technology platform containing micropatterned surfaces, where controlling the evaporation mode is desirable.
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