Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB
The quad flat no-lead package (QFN) is widely used in integrated circuits due to its advantages in performance and cost. With the increasing power of electronic products, effective heat dissipation from QFN packages has become crucial to prevent product damage. The focus of this study is to investig...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-11-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/13/23/12653 |