Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
Ball Grid Array (BGA) packaging method has been widely used in microelectronic devices, and electromigration (EM) in BGA is a crucial reliability issue, determining the performance of the products. Herein, we report a new failure mode induced by a coupling effect of EM and Joule heating in BGA struc...
| Hauptverfasser: | , , , |
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| Format: | Artikel |
| Sprache: | English |
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Elsevier
2024-01-01
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| Schriftenreihe: | Journal of Materials Research and Technology |
| Schlagworte: | |
| Online Zugang: | http://www.sciencedirect.com/science/article/pii/S2238785423032519 |