Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates
Buckling stability of thin films on compliant substrates is universal and essential in stretchable electronics. The dynamic behaviors of this special system are unavoidable when the stretchable electronics are in real applications. In this paper, an analytical model is established to investigate the...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-09-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/20/18/5425 |
| _version_ | 1797552996279648256 |
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| author | Xuanqing Fan Yi Wang Yuhang Li Haoran Fu |
| author_facet | Xuanqing Fan Yi Wang Yuhang Li Haoran Fu |
| author_sort | Xuanqing Fan |
| collection | DOAJ |
| description | Buckling stability of thin films on compliant substrates is universal and essential in stretchable electronics. The dynamic behaviors of this special system are unavoidable when the stretchable electronics are in real applications. In this paper, an analytical model is established to investigate the vibration of post-buckled thin films on a compliant substrate by accounting for the substrate as an elastic foundation. The analytical predictions of natural frequencies and vibration modes of the system are systematically investigated. The results may serve as guidance for the dynamic design of the thin film on compliant substrates to avoid resonance in the noise environment. |
| first_indexed | 2024-03-10T16:10:05Z |
| format | Article |
| id | doaj.art-db998213d5bd47dbbc794bf21565a7ba |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-03-10T16:10:05Z |
| publishDate | 2020-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-db998213d5bd47dbbc794bf21565a7ba2023-11-20T14:36:46ZengMDPI AGSensors1424-82202020-09-012018542510.3390/s20185425Vibration Analysis of Post-Buckled Thin Film on Compliant SubstratesXuanqing Fan0Yi Wang1Yuhang Li2Haoran Fu3Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, ChinaAircraft and Propulsion Laboratory, Ningbo Institute of Technology, Beihang University, Ningbo 315800, ChinaInstitute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, ChinaFrontier Research Center, Institute of Flexible Electronics Technology of THU. Zhejiang, Jiaxing 314006, ChinaBuckling stability of thin films on compliant substrates is universal and essential in stretchable electronics. The dynamic behaviors of this special system are unavoidable when the stretchable electronics are in real applications. In this paper, an analytical model is established to investigate the vibration of post-buckled thin films on a compliant substrate by accounting for the substrate as an elastic foundation. The analytical predictions of natural frequencies and vibration modes of the system are systematically investigated. The results may serve as guidance for the dynamic design of the thin film on compliant substrates to avoid resonance in the noise environment.https://www.mdpi.com/1424-8220/20/18/5425post-bucklingfree vibrationthin filmelastic substrateflexible electronics |
| spellingShingle | Xuanqing Fan Yi Wang Yuhang Li Haoran Fu Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates Sensors post-buckling free vibration thin film elastic substrate flexible electronics |
| title | Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates |
| title_full | Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates |
| title_fullStr | Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates |
| title_full_unstemmed | Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates |
| title_short | Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates |
| title_sort | vibration analysis of post buckled thin film on compliant substrates |
| topic | post-buckling free vibration thin film elastic substrate flexible electronics |
| url | https://www.mdpi.com/1424-8220/20/18/5425 |
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